20UPGPQ2601067

MODULE/COMPLETE

Component Information

Serial Number	20UPGPQ2601067
ProdDB ID	7f7677…ed57aa
LocalDB ID	647c51cf0722460042c4ed24
Component Type	MODULE_PCB
Parents	20UPGM22601067
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	Yamashita Material
PCB design version readonly	2
PCB vendor technology readonly	6
SMD population vendor	Hayashi REPIC Co.
PCB BOM version	12

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	647c51cf0722460042c4ed24
Stage	PCB_RECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	TakumiKumayama
ObjectId of this record	66ab50c0cc9e879ae55ca121
ObjectId of RAW record	66ab50bfcc9e879ae55ca120
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v1.0.14
INSTRUMENT
OPERATOR
COMPONENT_MISALIGNMENT_GRADE	1
DATA_CONNECTOR_ASSEMBLY_GRADE	1
HV_LV_CONNECTOR_ASSEMBLY_GRADE	1
OBSERVATION	-
OVERALL_GRADE	2
PARTICULATE_CONTAMINATION_GRADE	2
SCRATCHES_GRADE	1
SHORTS_OR_CLOSE_PROXIMITY_GRADE	1
SOLDERMASK_IRREGULARITIES_GRADE	1
SOLDER_SPILLS_GRADE	1
WATERMARKS_GRADE	1
WIREBOND_PADS_CONTAMINATION_GRADE	1

Visual Inspection Defects

Download front_image

Filename	Contents	Defects	Comment
front_tile5 Download front_tile5		Dusts

RAW Results Record

Download RAW

serialNumber

20UPGPQ2601067

testType

VISUAL_INSPECTION

subtestType

results

property

OPERATOR
INSTRUMENT
ANALYSIS_VERSION	None

comment

metadata

QCHELPER_VERSION

4.0.dev1

MODULE_SN

20UPGPQ2601067

front_defects

5	Yellow.Dusts

front_comments

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35

front_image

688d5694b00a059f6fc808fc

front_defect_images

5	688d5683b00a059f6fc8086a

Metadata

Measurements

WIREBOND_PADS_CONTAMINATION_GRADE

None

PARTICULATE_CONTAMINATION_GRADE

None

WATERMARKS_GRADE

None

SCRATCHES_GRADE

None

TRACES_GRADE

None

SOLDERMASK_IRREGULARITIES_GRADE

None

HV_LV_CONNECTOR_ASSEMBLY_GRADE

None

DATA_CONNECTOR_ASSEMBLY_GRADE

None

SOLDER_SPILLS_GRADE

None

COMPONENT_MISALIGNMENT_GRADE

None

SHORTS_OR_CLOSE_PROXIMITY_GRADE

None

OPENS_TOMBSTONING_GRADE

None

OVERALL_GRADE

None

OBSERVATION

None

stage

PCB_RECEPTION

component

647c51cf0722460042c4ed24

dbVersion

1.01

address

64657cef8d79bac1f3f005d9

sys

mts	2024-08-01 09:09:19.880000
cts	2024-08-01 09:09:19.880000
rev	0

ProductionDB Record

Expand ProductionDB Record

672c6a62c9d514897dd46328

state

ready

stateTs

2024-11-07T07:21:06.327Z

stateUserIdentity

2983-7671-1

date

2024-08-01T09:09:00.000Z

testType

id	5f644fba928ccc000ad1215f
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	64229fe1b8fd040036839f29
code	HR
name	Hayashi-Repic Co.

user

id	64e887fd9d1c7e00428f4775
userIdentity	2983-7671-1
firstName	Takumi
middleName
lastName	Kumayama

runNumber

66ab50c0cc9e879ae55ca121

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis version	string	single	False	1.0.14	None	None
INSTRUMENT	Instrument	string	single	False		None	None
OPERATOR	Operator	string	single	False		None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
COMPONENT_MISALIGNMENT_GRADE	Component misalignment (scale 1-3)	integer	single	None	False	1	None
DATA_CONNECTOR_ASSEMBLY_GRADE	Data connector assembly issue (scale 1-3)	integer	single	None	False	1	None
HV_LV_CONNECTOR_ASSEMBLY_GRADE	HV LV connector assembly issue (scale 1-3)	integer	single	None	False	1	None
OBSERVATION	Observation	string	single	None	False	-	None
OVERALL_GRADE	Overall grade (scale 1-3)	integer	single	None	False	2	None
PARTICULATE_CONTAMINATION_GRADE	Particulate contamination on the PCB including pick-up points (scale 1-3)	integer	single	None	False	2	None
SCRATCHES_GRADE	Scratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)	integer	single	None	False	1	None
SHORTS_OR_CLOSE_PROXIMITY_GRADE	Shorts/close proximity of components due to misalignment (scale 1-3)	integer	single	None	False	1	None
SOLDERMASK_IRREGULARITIES_GRADE	Soldermask irregularity/cracks grade (scale 1-3)	integer	single	None	False	1	None
SOLDER_SPILLS_GRADE	Solder spills as part of assembly process on wirebonding pads (scale 1-3)	integer	single	None	False	1	None
WATERMARKS_GRADE	Watermarks on the PCB (scale 1-3)	integer	single	None	False	1	None
WIREBOND_PADS_CONTAMINATION_GRADE	Wirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)	integer	single	None	False	1	None

cts

2024-11-07T07:21:06.327Z

sys

cts	2024-11-07T07:21:06.327Z
mts	2024-11-07T07:22:06.577Z
rev	5

defects

code	name	description	properties
b9fa026c06fb4eb7d13da07c	front_tile5	Yellow.Dusts

comments

None

attachments

code

9249ac102ca4af32a1a8cef579019ee9

dateTime

2024-11-07T07:21:06.871Z

title

RAW

description

RAW

contentType

text/plain

type

file

binaryStoreg02

True

filename

20UPGPQ2601067_PCB_RECEPTION_VISUAL_INSPECTION_672c6a62c9d514897dd46328_66ab50bfcc9e879ae55ca120.json

user

id	64e887fd9d1c7e00428f4775
userIdentity	2983-7671-1
firstName	Takumi
middleName
lastName	Kumayama

code

af27ba6755223e1b4d1772f691f921b6

dateTime

2024-11-07T07:21:07.551Z

title

front_image

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/a/f/2/af27ba6755223e1b4d1772f691f921b6?authz=zteos64:MDAwMDAyYjR4nO1QP0vDQByl9c_gJI6dfoiIS5q7a5JLfpPi1rEuSgj00ru0oW0upFeE4qD4GVwE8RM4iAgO4qK4dhIcHBxcFBz8Btbi4ODo6Bve8Hjv8XgLt-WFUrH4eH55N1-ZS003l8vlUb5WYjVb6YEtTE98c0sVWbvQw1ymg64tlbEmdjsvtLRkbAs7sVl9xecejbnrWV5ScyxKE2L5gcMt4cQJoTzwOAsa41K4JQxsDNsADAhD4iFzgBHmRjBMJVKHej4Np3MiaH8pNcLDUR6BSaXKDBZamypnxOUEHe4H6yFiMgG6tEqpVw38KiURZKKvcFoDMkOYjDXYLWIXRJ4jdPTA4O9BqfsizfCH0lYaYTCUGgmYQrQUgs5i1RG9BJeguTlzv3p47TdP3l7fj54_vJ3dxvjhJTm7ujitb-_dVP5__oOf4fhg_2n2EzUL2U0%3d

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/a/f/2/af27ba6755223e1b4d1772f691f921b6

filename

af27ba6755223e1b4d1772f691f921b6

user

id	64e887fd9d1c7e00428f4775
userIdentity	2983-7671-1
firstName	Takumi
middleName
lastName	Kumayama

code

3ecb298d17d133933c45f3324b82baae

dateTime

2024-11-07T07:22:00.362Z

title

front_tile5

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/3/e/c/3ecb298d17d133933c45f3324b82baae?authz=zteos64:MDAwMDAyYjN4nO1QPUvDQBimBTsUBHHs4os4dElyd2kuyTvp4lBw0TFkuPQuaWibC-kVoa6C_gInZ50FBXfFUV0E6Y9w0D9gLA4Ojo6-wzM8Hy8PT_uu2W5Ua69XN_etzkpuRqXcbM7LboO5jtJTR5ix-MaBqoqs0rNS5tORI5WxartTVlpaMnFquzPobwV-EHgu5xZP3Z5FaUqsxCXcEr0kJdQPuc_C_adGdCAM7MwyAAaEIeHIPGCEeTHMcom0R3lAo2WdGLIvxiV-NC9jMLlUhcFKa2P7jHgBrzUWbkeIaX3oUZtSboeBTUkMhZgoXL4BWSDUZQ2OqsQDUZYIQz01-HtQ6onIC_zBZEojTGdSIwFTiYFC0EWihmKc4joM1k5Wry8Wb-Pubuvh-D14eT577IYb53uLw8v2qK87_zv_wc7wcXp79AlPZ9Z6

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/3/e/c/3ecb298d17d133933c45f3324b82baae

filename

3ecb298d17d133933c45f3324b82baae

user

id	64e887fd9d1c7e00428f4775
userIdentity	2983-7671-1
firstName	Takumi
middleName
lastName	Kumayama

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

647c51cf0722460042c4ed24

7f767755c3e63c1152f082588bed57aa

ready

2023-06-04T08:56:47.020Z

24-6238-1

False

None

False

None

20UPGPQ2601067

None

parent

component

64ed37e6c96c32004230ef1f

code

f0dd42cb70997a03eb37b202e98ea3a1

state

ready

stateTs

2023-08-29T00:12:22.218Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22601067

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

highestLevelParent

component

64ed37e6c96c32004230ef1f

code

f0dd42cb70997a03eb37b202e98ea3a1

state

ready

stateTs

2023-08-29T00:12:22.218Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22601067

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita Material

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Preproduction OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Hayashi REPIC Co.
code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V1.1 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2

code	PCB_RECEPTION
name	Reception
order	1
initial	False
final	False

code	KEK
name	High Energy Accelerator Research Organization (KEK)

Current Stage: Module Complete

No tests are allocated for this stage.

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	Registered	Registered
Metrology (METROLOGY)	No result	N/A
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	No result	N/A
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
66aa5f…5c9fe9	PCB_RECEPTION	LAYER_THICKNESS	TakumiKumayama	N/A	a year ago	No tags	Selected
672c69…747cfd	PCB_RECEPTION	METROLOGY	TakumiKumayama	N/A	a year ago	No tags	Selected
66ab50…5ca121	PCB_RECEPTION	VISUAL_INSPECTION	TakumiKumayama	N/A	a year ago	No tags	Selected
66a33c…6a8a02	PCB_RECEPTION_MODULE_SITE	MASS	HideyukiOide	N/A	a year ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ2601067

MODULE/COMPLETE

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: Module Complete

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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