20UPGPQ2601022

MODULE/INITIAL_WARM

Component Information

Serial Number 20UPGPQ2601022
ProdDB ID  f96ce7…b413be
LocalDB ID 647c517aaee8d7004197c895
Component Type MODULE_PCB
Parents 20UPGM22601022 
Children No match.
Flags

 Properties

Item Value
PCB Manufacturer Yamashita Material
PCB design version readonly 2
PCB vendor technology readonly 6
SMD population vendor Hayashi REPIC Co.

 Comments


Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2 years ago
component ObjectId 647c517aaee8d7004197c895
Stage PCB_RECEPTION_MODULE_SITE
Test Type METROLOGY
Institute ObjectId
User Name TakanoriKono
ObjectId of this record 652f396e8542040041ae3cee
ObjectId of RAW record None
Tags No tags

Results

Key Data
X-Y_DIMENSION_WITHIN_ENVELOP True
X_DIMENSION 39.566
Y_DIMENSION 40.353
DIAMETER_DOWEL_HOLE_A 3.011
WIDTH_DOWEL_SLOT_B 3.056
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS 0.213
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS 0.002
HV_CAPACITOR_THICKNESS 0
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP True
AVERAGE_THICKNESS_POWER_CONNECTOR 0

ProductionDB Record

id652f396e8542040041ae3cee
stateready
stateTs2023-10-18T01:48:30.179Z
stateUserIdentity3499-3579-1
date2023-09-28T02:13:30.199Z
testType
id60255faf86dec3000ad0330d
codeMETROLOGY
nameMetrology
stateactive
institution
id5d31879ddf98f200097387f5
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)
user
id5ed8ce51d2f910000af74b84
userIdentity3499-3579-1
firstNameTakanori
middleName
lastNameKono
runNumber1
passedTrue
problemsFalse
propertiesNone
results
codenameorderdataTypevalueTypearrayDimensionsadditionalvalueassociateChild
X-Y_DIMENSION_WITHIN_ENVELOPX-Y dimension within envelope1booleansingleNoneFalseTrueNone
X_DIMENSIONX dimension [mm]1floatsingleNoneFalse39.566None
Y_DIMENSIONY dimension [mm]1floatsingleNoneFalse40.353None
DIAMETER_DOWEL_HOLE_ADiameter of dowel hole A (top left) (for PCB reception from vendor only) [mm]4floatsingleNoneFalse3.011None
WIDTH_DOWEL_SLOT_BWidth of dowel slot B (bottom right) (for PCB reception from vendor only) [mm]5floatsingleNoneFalse3.056None
AVERAGE_THICKNESS_FECHIP_PICKUP_AREASAverage thickness of all pick-up areas [mm]6floatsingle1False0.213None
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREASStd deviation of thickness of all pick-up area [mm]7floatsingle1False0.002None
HV_CAPACITOR_THICKNESSHV capacitor thickness [mm]8floatsingleNoneFalse0None
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOPHV capacitor thickness within envelop9booleansingleNoneFalseTrueNone
AVERAGE_THICKNESS_POWER_CONNECTORThickness including the black body of power connector (excluding pins) [mm]10floatsingleNoneFalse0None
cts2023-10-18T01:48:30.179Z
sys
cts2023-10-18T01:48:30.179Z
mts2023-10-18T01:48:30.179Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
647c517aaee8d7004197c895f96ce73cbe6a11bf0ae2eaf984b413beready2023-06-04T08:55:22.608Z24-6238-1FalseFalseNoneNoneFalseNoneNone20UPGPQ2601022None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueYamashita Material
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valuePreproduction OS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueYamashita Material (75 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
  • codeSMD_POPULATION_VENDOR
    nameSMD population vendor
    dataTypestring
    requiredFalse
    defaultFalse
    valueHayashi REPIC Co.
codePCB_RECEPTION_MODULE_SITE
namePCB Reception at module site
order10
initialFalse
finalFalse
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)

 Current Stage: Initial Warm

Past QC Stages and Results

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test Local Result ProdDB Record
Mass
(MASS)		 Registered Registered
Metrology
(METROLOGY)		 Registered Registered
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 No result N/A
LV and HV Test
(HV_LV_TEST)		 No result N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test Local Result ProdDB Record
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A

(UNKNOWN CODE)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A

(UNKNOWN CODE)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test Local Result ProdDB Record
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A

(UNKNOWN CODE)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

Population (PCB_POPULATION)

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 No result N/A
Image capture test
(IMAGE_CAPTURE_TEST)		 No result N/A
Layer thickness measurement
(LAYER_THICKNESS)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
652f3a…d987c9 PCB_RECEPTION_MODULE_SITE MASS TakanoriKono N/A 2 years ago No tags Selected
652f39…ae3cee PCB_RECEPTION_MODULE_SITE METROLOGY TakanoriKono N/A 2 years ago No tags Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Tab cutting and gross defect inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
Back to top page of this component