20UPGB42302001

MODULE/INITIAL_WARM

Component Information

Serial Number 20UPGB42302001
ProdDB ID  214740…8e3783
LocalDB ID 647bec3daee8d70041976f38
Component Type BARE_MODULE
Parents 20UPGM22601022  20UPGM22601022 
Children 20UPGFC0088388 FE Chip 20UPGFC0088424 FE Chip 20UPGFC0088361 FE Chip 20UPGFC0088503 FE Chip 20UPGS33300039 Sensor Tile 20UPGFC0088388 FE Chip 20UPGFC0088424 FE Chip 20UPGFC0088361 FE Chip 20UPGFC0088503 FE Chip 20UPGS33300039 Sensor Tile
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version readonly 2
Sensor Type 5
Vendor code readonly 1
Thickness of FE chips (RD53A) None

 Comments


Test: MASS_MEASUREMENT QC Passed

(Stage: BAREMODULERECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2 years ago
component ObjectId 647bec3daee8d70041976f38
Stage BAREMODULERECEPTION
Test Type MASS_MEASUREMENT
Institute ObjectId
User Name TakanoriKono
ObjectId of this record 652f3c4b8542040041ae42a7
ObjectId of RAW record None
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat v1
SCALE_ACCURACY 0.001
MASS 1245

ProductionDB Record

id652f3c4b8542040041ae42a7
stateready
stateTs2023-10-18T02:00:43.094Z
stateUserIdentity3499-3579-1
date2023-10-18T01:57:11.595Z
testType
id5f87daff50d75e000a335805
codeMASS_MEASUREMENT
nameMass Measurement
stateactive
institution
id5d31879ddf98f200097387f5
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)
user
id5ed8ce51d2f910000af74b84
userIdentity3499-3579-1
firstNameTakanori
middleName
lastNameKono
runNumber1
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis VersionstringsingleFalse1NoneNone
SCALE_ACCURACYScale Accuracy [mg]floatsingleFalse0.001NoneNone
results
codenameorderdataTypevalueTypearrayDimensionsadditionalvalueassociateChild
MASSMass [mg]1floatsingleNoneFalse1245None
cts2023-10-18T02:00:43.094Z
sys
cts2023-10-18T02:00:43.094Z
mts2023-10-18T02:00:43.094Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
647bec3daee8d70041976f38214740bd80ed7e30f3f7b55e6a8e3783ready2023-06-04T01:43:25.422Z24-6238-1FalseFalseNoneNoneFalseNoneNone20UPGB42302001None
codeP
namePixels
codePG
namePixel general
codeBARE_MODULE
nameBare Module
codeQUAD_BARE_MODULE
nameQuad bare module
codenamedataTyperequireddefaultvaluecodeTable
FECHIP_VERSIONFE chip versioncodeTableTrueFalseITkpix_v1.1
codevalue
0RD53A
1ITkpix_v1
2ITkpix_v1.1
3ITkpix_v2
9No FE chip
SENSOR_TYPESensor TypecodeTableTrueFalseOuter pixel quad sensor tile
codevalue
0No sensor
1Market survey sensor tile
2L0 inner pixel 3D sensor tile
3L0 inner pixel planar sensor tile
4L1 inner pixel quad sensor tile
5Outer pixel quad sensor tile
9Dummy sensor tile
VENDORVendor codecodeTableTrueFalseHPK
codevalue
0Advacam
1HPK
2IZM
3Leonardo
9ITk institute
codeBAREMODULERECEPTION
nameReception at ITk institute
order3
initialFalse
finalFalse
codeHPK
nameHamamatsu Photonics K.K (HPK)

 Current Stage: Initial Warm

Past QC Stages and Results

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)		 Registered Registered
Flatness
(FLATNESS)		 No result N/A
Mass Measurement
(MASS_MEASUREMENT)		 Registered Registered
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)		 Registered Registered
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
652f40…ae4d5e BAREMODULERECEPTION VISUAL_INSPECTION TakanoriKono N/A 2 years ago No tags Selected
652f3c…ae42a7 BAREMODULERECEPTION MASS_MEASUREMENT TakanoriKono N/A 2 years ago No tags Selected
652f38…ae3b5d BAREMODULERECEPTION QUAD_BARE_MODULE_METROLOGY TakanoriKono N/A 2 years ago No tags Selected
65030a…2b8343 BAREMODULERECEPTION BARE_MODULE_SENSOR_IV DaikiSameshima N/A 2 years ago No tags Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
Back to top page of this component