Top Page > Component List > 20UPGB42302001 > QC Result / BAREMODULERECEPTION / BARE_MODULE_SENSOR_IV

20UPGB42302001
Quad-BareModule/ITkPix_v1.1/HPK
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGB42302001
Production DB Component ID 214740bd80ed7e30f3f7b55e6a8e3783
LocalDB Component ID 647bec3daee8d70041976f38
Component Type bare_module
Super-Component 20UPGM22601022  20UPGM22601022 
Sub-Components •  20UPGFC0088388   FE Chip
•  20UPGFC0088424   FE Chip
•  20UPGFC0088361   FE Chip
•  20UPGFC0088503   FE Chip
•  20UPGS33300039   Sensor Tile
•  20UPGFC0088388   FE Chip
•  20UPGFC0088424   FE Chip
•  20UPGFC0088361   FE Chip
•  20UPGFC0088503   FE Chip
•  20UPGS33300039   Sensor Tile
Flags

Properties

Item Data Type Value
FE chip version codeTable 2
Sensor Type codeTable 5
Vendor code codeTable 1
Thickness of FE chips (RD53A) codeTable None

Comments


Test: BARE_MODULE_SENSOR_IV QC Passed

(Stage: BAREMODULERECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2023-09-14 06:31:44 PDT(-0700)
component ObjectId 647bec3daee8d70041976f38
Stage BAREMODULERECEPTION
Test Type BARE_MODULE_SENSOR_IV
Institute ObjectId
User Name DaikiSameshima
ObjectId of this record 65030aee4b3bc5b6c32b8343
ObjectId of RAW record 65030aec4b3bc5b6c32b8342

Results

Key Data
LINK_TO_SENSOR_IV_TEST 20UPGS33300039 : Passed2 (mqat v1.0.6)
NON_WORKING_FE_CHIPS N/A

RAW Results Record

Download RAW
_id65030aec4b3bc5b6c32b8342
raw
serialNumbertestTyperesultsstagecomponentdbVersionaddresssys
20UPGB42302001BARE_MODULE_SENSOR_IV
property
comment
metadata
QCHELPER_VERSION4.0.dev1
MODULE_SN20UPGB42302001
Metadata
Measurements
LINK_TO_SENSOR_IV_TEST65030aec4b3bc5b6c32b8341
NON_WORKING_FE_CHIPSNone
BAREMODULERECEPTION647bec3daee8d70041976f381.0164657cef8d79bac1f3f005d9
mts2023-09-14 13:30:20.339000
cts2023-09-14 13:30:20.339000
rev0
rawHash8abf430ddc6504b6939b29ff5909f83e
stageBAREMODULERECEPTION

ProductionDB Record

id65030b4080b6fa0042a05458
stateready
stateTs2023-09-14T13:31:44.589Z
stateUserIdentity8241-2535-1
date2023-09-14T13:30:00.000Z
testType
id63a087f8641a3f0036a0e8a7
codeBARE_MODULE_SENSOR_IV
nameSensor IV on bare module
stateactive
institution
id64229fe1b8fd040036839f29
codeHR
nameHayashi-Repic Co.
user
id625d2240d7b94b000b6dc609
userIdentity8241-2535-1
firstNameDaiki
middleName
lastNameSameshima
runNumber65030aee4b3bc5b6c32b8343
passedTrue
problemsFalse
propertiesNone
results
codenameorderdataTypevalueTypearrayDimensionsadditionalrangeMinrangeMaxvalueassociateChild
LINK_TO_SENSOR_IV_TESTLink to sensor IV test result1testRunsingleNoneFalseNoneNone
id65030b3d4203f0004202952f
testType
id5b1a3abf130f5600054a42a8
codeIV_MEASURE
nameIV measurement
runNumber65030aec4b3bc5b6c32b8341
passedTrue
stateready
problemsFalse
date2023-09-14T13:30:00.000Z
None
NON_WORKING_FE_CHIPSNon-working FE chips (if first connection failed)2floatarray1FalseNoneNoneNoneNone
cts2023-09-14T13:31:44.589Z
sys
cts2023-09-14T13:31:44.589Z
mts2023-09-14T13:31:44.951Z
rev1
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypefilenameuser
d1ca7fa3fa614669ea1d0001e1de649b2023-09-14T13:31:44.937ZRAWRAWapplication/jsonfile20UPGB42302001_BAREMODULERECEPTION_BARE_MODULE_SENSOR_IV_65030b4080b6fa0042a05458_65030aec4b3bc5b6c32b8342.json
id625d2240d7b94b000b6dc609
userIdentity8241-2535-1
firstNameDaiki
middleName
lastNameSameshima
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierancestorMapprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
647bec3daee8d70041976f38214740bd80ed7e30f3f7b55e6a8e3783ready2023-06-04T01:43:25.422Z24-6238-1FalseFalseNoneNoneFalseNoneNone20UPGB42302001None
parent
component
id6498f97f6a25bf0042ebdd98
codef193185e0439e0b0795d0f4b4fef0a81
stateready
stateTs2023-06-26T02:35:43.771Z
stateUserIdentity6436-7637-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM22601022
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/INITIAL_COLD
nameInitial Cold
highestLevelParent
component
id6498f97f6a25bf0042ebdd98
codef193185e0439e0b0795d0f4b4fef0a81
stateready
stateTs2023-06-26T02:35:43.771Z
stateUserIdentity6436-7637-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM22601022
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/INITIAL_COLD
nameInitial Cold
codeP
namePixels
codePG
namePixel general
codeBARE_MODULE
nameBare Module
codeQUAD_BARE_MODULE
nameQuad bare module
codenamedataTyperequireddefaultvaluecodeTable
FECHIP_VERSIONFE chip versioncodeTableTrueFalseITkpix_v1.1
codevalue
0RD53A
1ITkpix_v1
2ITkpix_v1.1
3ITkpix_v2
9No FE chip
SENSOR_TYPESensor TypecodeTableTrueFalseOuter pixel quad sensor tile
codevalue
0No sensor
1Market survey sensor tile
2L0 inner pixel 3D sensor tile
3L0 inner pixel planar sensor tile
4L1 inner pixel quad sensor tile
5Outer pixel quad sensor tile
9Dummy sensor tile
VENDORVendor codecodeTableTrueFalseHPK
codevalue
0Advacam
1HPK
2IZM
3Leonardo
9ITk institute
codeBAREMODULERECEPTION
nameReception at ITk institute
order3
initialFalse
finalFalse
codeHPK
nameHamamatsu Photonics K.K (HPK)

Current Stage: Initial Warm

No tests are allocated for this stage.

Past QC Stages and Results

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

No tests are allocated for this stage.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

No tests are allocated for this stage.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

  Stage: Reception at ITk institute (BAREMODULERECEPTION) Complete

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Flatness
(FLATNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Mass Measurement
(MASS_MEASUREMENT)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Not to be used for the detector (NOT_USED) Complete

No tests are allocated for this stage.

  Stage: Bare module failed test, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: Bare module assembly (BAREMODULEASSEMBLY) Complete

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
652f40da8542040041ae4d5e BAREMODULERECEPTION VISUAL_INSPECTION TakanoriKono 2023-10-17 19:20:10 PDT(-0700) Selected
652f3c4b8542040041ae42a7 BAREMODULERECEPTION MASS_MEASUREMENT TakanoriKono 2023-10-17 19:00:43 PDT(-0700) Selected
652f386b8542040041ae3b5d BAREMODULERECEPTION QUAD_BARE_MODULE_METROLOGY TakanoriKono 2023-10-17 18:44:11 PDT(-0700) Selected
65030aee4b3bc5b6c32b8343 BAREMODULERECEPTION BARE_MODULE_SENSOR_IV DaikiSameshima 2023-09-14 06:31:44 PDT(-0700) Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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