20UPGPQ2110576

MODULE/LONG_TERM_STABILITY_TEST

Component Information

Serial Number	20UPGPQ2110576
ProdDB ID	7b1a35…5bbec0
LocalDB ID	645a28ea012cc800429a261b
Component Type	MODULE_PCB
Parents	No match.
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	EPEC
PCB design version readonly	1
PCB vendor technology readonly	1
SMD population vendor	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	645a28ea012cc800429a261b
Stage	PCB_RECEPTION_MODULE_SITE
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	TanviWamorkar
ObjectId of this record	64b692c90ca4ae0042dcd3ca
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vv1
INSTRUMENT	Keyence
OPERATOR	Tanvi Wamorkar
WIREBOND_PADS_CONTAMINATION_GRADE	1
PARTICULATE_CONTAMINATION_GRADE	1
WATERMARKS_GRADE	1
SCRATCHES_GRADE	1
SOLDERMASK_IRREGULARITIES_GRADE	1
HV_LV_CONNECTOR_ASSEMBLY_GRADE	1
DATA_CONNECTOR_ASSEMBLY_GRADE	1
SOLDER_SPILLS_GRADE	1
COMPONENT_MISALIGNMENT_GRADE	1
SHORTS_OR_CLOSE_PROXIMITY_GRADE	1
OVERALL_GRADE	1
OBSERVATION	N/A

ProductionDB Record

Expand ProductionDB Record

64b692c90ca4ae0042dcd3ca

state

ready

stateTs

2023-07-18T13:25:29.667Z

stateUserIdentity

5937-5083-1

date

2023-07-18T13:24:00.000Z

testType

id	5f644fba928ccc000ad1215f
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6202fb94987fb9000ab47762
userIdentity	5937-5083-1
firstName	Tanvi
middleName
lastName	Wamorkar

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis version	string	single	False	v1	None	None
INSTRUMENT	Instrument	string	single	False	Keyence	None	None
OPERATOR	Operator	string	single	False	Tanvi Wamorkar	None	None

results

code	name	order	dataType	valueType	arrayDimensions	additional	value	associateChild
WIREBOND_PADS_CONTAMINATION_GRADE	Wirebond pads clear of contamination grade (scale 1-3)	3	integer	single	None	False	1	None
PARTICULATE_CONTAMINATION_GRADE	Particulate contamination grade (scale 1-3)	4	integer	single	None	False	1	None
WATERMARKS_GRADE	Watermarks grade (scale 1-3)	5	integer	single	None	False	1	None
SCRATCHES_GRADE	Scratches grade (scale 1-3)	6	integer	single	None	False	1	None
SOLDERMASK_IRREGULARITIES_GRADE	Soldermask irregularity/cracks grade (scale 1-3)	7	integer	single	None	False	1	None
HV_LV_CONNECTOR_ASSEMBLY_GRADE	HV LV connector assembly issue grade (scale 1-3)	8	integer	single	None	False	1	None
DATA_CONNECTOR_ASSEMBLY_GRADE	Data connector assembly issue grade (scale 1-3)	9	integer	single	None	False	1	None
SOLDER_SPILLS_GRADE	Solder spills grade (scale 1-3)	10	integer	single	None	False	1	None
COMPONENT_MISALIGNMENT_GRADE	Component misalignment grade (scale 1-3)	11	integer	single	None	False	1	None
SHORTS_OR_CLOSE_PROXIMITY_GRADE	Shorts/close proximity of components due to misalignment grade (scale 1-3)	12	integer	single	None	False	1	None
OVERALL_GRADE	Overall grade (scale 1-5)	13	integer	single	None	False	1	None
OBSERVATION	Observation	14	string	single	None	False	None	None

cts

2023-07-18T13:25:29.667Z

sys

cts	2023-07-18T13:25:29.667Z
mts	2023-07-18T13:25:29.667Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

645a28ea012cc800429a261b

7b1a352030557e26c12e63a4195bbec0

ready

2023-05-09T11:05:14.015Z

2355-570-1

False

None

False

None

20UPGPQ2110576

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value EPEC

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Prototype

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

EPEC (100 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code	PCB_RECEPTION_MODULE_SITE
name	PCB Reception at module site
order	10
initial	False
final	False

code	EDI
name	University of Edinburgh

Current Stage: Long Term Stability Test

No tests are allocated for this stage.

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	Registered	Registered

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	No result	N/A
Metrology (METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
64b692…dcd3ca	PCB_RECEPTION_MODULE_SITE	VISUAL_INSPECTION	TanviWamorkar	N/A	2 years ago	No tags	Selected
64b5ad…8677ca	PCB_RECEPTION_MODULE_SITE	MASS	TanviWamorkar	N/A	2 years ago	No tags	Selected
64b576…859c38	PCB_RECEPTION_MODULE_SITE	METROLOGY	TanviWamorkar	N/A	2 years ago	No tags	Selected
647efb…c79dfd	PCB_QC	HV_LV_TEST	FuatUstuner	N/A	2 years ago	No tags	Selected
647efa…9a76e9	QA_PRE_THERMAL_CYCLE	LAYER_THICKNESS	FuatUstuner	N/A	2 years ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ2110576

MODULE/LONG_TERM_STABILITY_TEST

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Long Term Stability Test

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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