20UPGPQ2110576

MODULE/LONG_TERM_STABILITY_TEST

Component Information

Serial Number 20UPGPQ2110576
ProdDB ID  7b1a35…5bbec0
LocalDB ID 645a28ea012cc800429a261b
Component Type MODULE_PCB
Parents No match.
Children No match.
Flags

 Properties

Item Value
PCB Manufacturer EPEC
PCB design version readonly 1
PCB vendor technology readonly 1
SMD population vendor None

 Comments


Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2 years ago
component ObjectId 645a28ea012cc800429a261b
Stage PCB_RECEPTION_MODULE_SITE
Test Type METROLOGY
Institute ObjectId
User Name TanviWamorkar
ObjectId of this record 64b57669c8312c0042859c38
ObjectId of RAW record None
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat vv1
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS 0.20836374999999988
AVERAGE_THICKNESS_POWER_CONNECTOR 1.5327899999999997
HV_CAPACITOR_THICKNESS 1.9391600000000002
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS 0.0017737286115694054
X_DIMENSION 39.54295
Y_DIMENSION 40.54896
X-Y_DIMENSION_WITHIN_ENVELOP True
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP True

ProductionDB Record

id64b57669c8312c0042859c38
stateready
stateTs2023-07-17T17:12:09.521Z
stateUserIdentity5937-5083-1
date2023-07-17T12:04:07.000Z
testType
id60255faf86dec3000ad0330d
codeMETROLOGY
nameMetrology
stateactive
institution
id5d318624df98f200097386d5
codeANL
nameArgonne National Laboratory
user
id6202fb94987fb9000ab47762
userIdentity5937-5083-1
firstNameTanvi
middleName
lastNameWamorkar
runNumber1
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis VersionstringsingleFalsev1NoneNone
results
codenameorderdataTypevalueTypearrayDimensionsadditionalvalueassociateChild
AVERAGE_THICKNESS_FECHIP_PICKUP_AREASAverage thickness of all pick-up areas [mm]1floatsingle1False0.20836374999999988None
AVERAGE_THICKNESS_POWER_CONNECTORThickness including the black body of power connector (excluding pins) [mm]1floatsingleNoneFalse1.5327899999999997None
HV_CAPACITOR_THICKNESSHV capacitor thickness [mm]1floatsingleNoneFalse1.9391600000000002None
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREASStd deviation of thickness of all pick-up area [mm]1floatsingle1False0.0017737286115694054None
X_DIMENSIONX dimension [mm]1floatsingleNoneFalse39.54295None
Y_DIMENSIONY dimension [mm]2floatsingleNoneFalse40.54896None
X-Y_DIMENSION_WITHIN_ENVELOPX-Y dimension within envelope [mm]3booleansingleNoneFalseTrueNone
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOPHV capacitor thickness within envelop7booleansingleNoneFalseTrueNone
cts2023-07-17T17:12:09.521Z
sys
cts2023-07-17T17:12:09.521Z
mts2023-07-17T17:12:09.521Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
645a28ea012cc800429a261b7b1a352030557e26c12e63a4195bbec0ready2023-05-09T11:05:14.015Z2355-570-1FalseFalseNoneNoneFalseNoneNone20UPGPQ2110576None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueEPEC
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valuePrototype
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueEPEC (100 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
codePCB_RECEPTION_MODULE_SITE
namePCB Reception at module site
order10
initialFalse
finalFalse
codeEDI
nameUniversity of Edinburgh

 Current Stage: Long Term Stability Test

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test Local Result ProdDB Record
Mass
(MASS)		 Registered Registered
Metrology
(METROLOGY)		 Registered Registered
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 No result N/A
LV and HV Test
(HV_LV_TEST)		 Registered Registered

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test Local Result ProdDB Record
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test Local Result ProdDB Record
Layer thickness measurement
(LAYER_THICKNESS)		 Registered Registered
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

Population (PCB_POPULATION)

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 No result N/A
Image capture test
(IMAGE_CAPTURE_TEST)		 No result N/A
Layer thickness measurement
(LAYER_THICKNESS)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
64b692…dcd3ca PCB_RECEPTION_MODULE_SITE VISUAL_INSPECTION TanviWamorkar N/A 2 years ago No tags Selected
64b5ad…8677ca PCB_RECEPTION_MODULE_SITE MASS TanviWamorkar N/A 2 years ago No tags Selected
64b576…859c38 PCB_RECEPTION_MODULE_SITE METROLOGY TanviWamorkar N/A 2 years ago No tags Selected
647efb…c79dfd PCB_QC HV_LV_TEST FuatUstuner N/A 2 years ago No tags Selected
647efa…9a76e9 QA_PRE_THERMAL_CYCLE LAYER_THICKNESS FuatUstuner N/A 2 years ago No tags Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Tab cutting and gross defect inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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