EPEC-100um

ITkPD Component Page Jump to ITkPD component page

Component Information

Item	Value
Serial Number	20UPGPQ2110264
Production DB Component ID	eb9f4320cd70f9e706aab42e3d8c1c65
LocalDB Component ID	645a2881fde33a00427d7c1c
Component Type	module_pcb
Super-Component	20UPGM22110264
Sub-Components	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Data Type	Value
PCB Manufacturer	string	EPEC
PCB design version	codeTable	1
PCB vendor technology	codeTable	1
SMD population vendor	string	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	2024-04-22 04:01:37 PDT(-0700)
component ObjectId	645a2881fde33a00427d7c1c
Stage	PCB_RECEPTION_MODULE_SITE
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	MarioJose
ObjectId of this record	6626412b5e538000343f33a6
ObjectId of RAW record	None

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
INSTRUMENT	None
OPERATOR	None
WIREBOND_PADS_CONTAMINATION_GRADE	N/A
PARTICULATE_CONTAMINATION_GRADE	N/A
WATERMARKS_GRADE	N/A
SCRATCHES_GRADE	N/A
TRACES_GRADE	N/A
SOLDERMASK_IRREGULARITIES_GRADE	N/A
HV_LV_CONNECTOR_ASSEMBLY_GRADE	N/A
DATA_CONNECTOR_ASSEMBLY_GRADE	N/A
SOLDER_SPILLS_GRADE	N/A
COMPONENT_MISALIGNMENT_GRADE	N/A
SHORTS_OR_CLOSE_PROXIMITY_GRADE	N/A
OPENS_TOMBSTONING_GRADE	N/A
OVERALL_GRADE	1
OBSERVATION	N/A

ProductionDB Record

Expand ProductionDB Record

6626412b5e538000343f33a6

state

ready

stateTs

2024-04-22T10:51:23.803Z

stateUserIdentity

6200-2650-1

date

2023-09-22T10:36:00.000Z

testType

id	5f644fba928ccc000ad1215f
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d41d52cf6e07b000a559ada
code	INFN_GENOA
name	INFN Genoa

user

id	64526724012cc8004282cb9e
userIdentity	6200-2650-1
firstName	Mario
middleName
lastName	Jose

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis version	string	single	False	None	None	None
INSTRUMENT	Instrument	string	single	False	None	None	None
OPERATOR	Operator	string	single	False	None	None	None

results

code	WIREBOND_PADS_CONTAMINATION_GRADE
name	Wirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)
order	1
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	PARTICULATE_CONTAMINATION_GRADE
name	Particulate contamination on the PCB including pick-up points (scale 1-3)
order	2
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code WATERMARKS_GRADE
name Watermarks on the PCB (scale 1-3)
order 3
dataType integer
valueType single
arrayDimensions None
additional False
value None
associateChild None

code	SCRATCHES_GRADE
name	Scratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)
order	4
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	TRACES_GRADE
name	Issues seen on traces like spurious copper, spur, mousebit, pin hole, short, breakout etc. that reduce/cut the copper traces width (grade 1-3)
order	5
dataType	integer
valueType	single
arrayDimensions	None
additional	False
rangeMin	None
rangeMax	None
value	None
associateChild	None

code SOLDERMASK_IRREGULARITIES_GRADE
name Soldermask irregularity/cracks grade (scale 1-3)
order 6
dataType integer
valueType single
arrayDimensions None
additional False
value None
associateChild None
code HV_LV_CONNECTOR_ASSEMBLY_GRADE
name HV LV connector assembly issue (scale 1-3)
order 7
dataType integer
valueType single
arrayDimensions None
additional False
value None
associateChild None
code DATA_CONNECTOR_ASSEMBLY_GRADE
name Data connector assembly issue (scale 1-3)
order 8
dataType integer
valueType single
arrayDimensions None
additional False
value None
associateChild None
code SOLDER_SPILLS_GRADE
name Solder spills as part of assembly process on wirebonding pads (scale 1-3)
order 9
dataType integer
valueType single
arrayDimensions None
additional False
value None
associateChild None
code COMPONENT_MISALIGNMENT_GRADE
name Component misalignment (scale 1-3)
order 10
dataType integer
valueType single
arrayDimensions None
additional False
value None
associateChild None

code	SHORTS_OR_CLOSE_PROXIMITY_GRADE
name	Shorts/close proximity of components due to misalignment (scale 1-3)
order	11
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	OPENS_TOMBSTONING_GRADE
name	Opens or tombstoning, where one end of the component lifts from a pad of the PCB during the soldering process, (scale 1-3)
order	12
dataType	integer
valueType	single
arrayDimensions	None
additional	False
rangeMin	None
rangeMax	None
value	None
associateChild	None

code OVERALL_GRADE
name Overall grade (scale 1-3)
order 13
dataType integer
valueType single
arrayDimensions None
additional False
value 1
associateChild None
code OBSERVATION
name Observation
order 14
dataType string
valueType single
arrayDimensions None
additional False
value None
associateChild None

cts

2024-04-22T10:51:23.803Z

sys

cts	2024-04-22T10:51:23.803Z
mts	2024-04-22T11:01:37.124Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

url

filename

user

081f17521fc16ed9390825f3a2a560c9

2024-04-22T11:01:37.124Z

a testRun image attachment

from webApp 2024-04-22T11:01Z

None

eos

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/0/8/1/081f17521fc16ed9390825f3a2a560c9?authz=zteos64:MDAwMDAyOWN4nO2QsUvDQBTGScEKBUEcC8pZHFwuubtc2uRNTgoddYwZLt4lhtpcSC5LwcnVwdlZxMlF0M2lbi66Kf4Ljo4KxuLg4OTsGz4eP773-Pg6N62OVS6-XT5dtbtzmRkVsteaFOsWcx2lK0eYA_Gte6rM01LXhcyqkSOVwY3dKUotsYwd4vgOHa6RQcIYkQK7hMWYUpXgmAuCBY8TQgeBJ1mwPbXCHWHQsM4RY4gwIBw4R4wwHqE6k0A57fs0nMWJUPpFXDIIJ0WETCZVbqDU2tiUB8z3GTDPczdCgKQZ8KhNad8OfJuSCOVirGD2B8kcUJPWwKiMPSSKAtC-rgz8fij1WGQ5_CCp0kA86qKqls22hG4ftqKTY2zhw9Pp5gek1_Nnu72Llce74OjldXl1ofvf7R-7Re_nz_ftTzRzzfY%3d

081f17521fc16ed9390825f3a2a560c9

id	64526724012cc8004282cb9e
userIdentity	6200-2650-1
firstName	Mario
middleName
lastName	Jose

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

645a2881fde33a00427d7c1c

eb9f4320cd70f9e706aab42e3d8c1c65

ready

2023-05-09T11:03:29.960Z

2355-570-1

False

None

False

None

20UPGPQ2110264

None

parent

component

658458bc13093c0042d7df0e

code

ed6f161d47411e39e1c2691051d7c13e

state

ready

stateTs

2023-12-21T15:24:44.301Z

stateUserIdentity

7608-2618-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22110264

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

highestLevelParent

component

658458bc13093c0042d7df0e

code

ed6f161d47411e39e1c2691051d7c13e

state

ready

stateTs

2023-12-21T15:24:44.301Z

stateUserIdentity

7608-2618-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22110264

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value EPEC

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Prototype

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

EPEC (100 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code	PCB_RECEPTION_MODULE_SITE
name	PCB Reception at module site
order	9
initial	False
final	False

code	EDI
name	University of Edinburgh

Current Stage: Initial Cold

No tests are allocated for this stage.

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Not signed-off

No tests are allocated for this stage.

Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

Stage: Wire Bonding (MODULE/WIREBONDING) Complete

No tests are allocated for this stage.

Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

Results Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Test	Local Result	ProdDB Record
Mass (MASS)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Metrology (METROLOGY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: PCB ready for module (PCB_READY_FOR_MODULE) Complete

No tests are allocated for this stage.

Stage: Test failed, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

Results Stage: QC (PCB_QC) Complete

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
LV and HV Test (HV_LV_TEST)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Results Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Complete

Test	Local Result	ProdDB Record
Metrology (METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
NTC Verification (NTC_VERIFICATION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
SLDO and precision resistors (SLDO_RESISTORS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Not signed-off

No tests are allocated for this stage.

Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Not signed-off

No tests are allocated for this stage.

Results Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Complete

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
NTC Verification (NTC_VERIFICATION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Complete

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Layer thickness measurement (LAYER_THICKNESS)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Metrology (METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
NTC Verification (NTC_VERIFICATION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
SLDO and precision resistors (SLDO_RESISTORS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Cutting (PCB_CUTTING) Complete

Test	Local Result	ProdDB Record
Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Population (PCB_POPULATION) Complete

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

Results Stage: Reception (PCB_RECEPTION) Complete

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Image capture test (IMAGE_CAPTURE_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Layer thickness measurement (LAYER_THICKNESS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology (METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID	Stage	Test Name	Inspector	Date	QC Registration
6626412b5e538000343f33a6	PCB_RECEPTION_MODULE_SITE	VISUAL_INSPECTION	MarioJose	2024-04-22 04:01:37 PDT(-0700)	Selected
65e1a36c100c7d0035e91ef5	PCB_RECEPTION_MODULE_SITE	METROLOGY	MarioJose	2024-03-01 01:44:12 PST(-0800)	Selected
6537a9c4dfc4620042d0ee1b	PCB_RECEPTION_MODULE_SITE	MASS	MarioJose	2023-10-24 04:25:56 PDT(-0700)	Selected
65367bf9f815eb00426af0ea	PCB_RECEPTION_MODULE_SITE	METROLOGY	MarioJose	2023-10-23 06:58:17 PDT(-0700)
65266d64d2e42500423057b0	PCB_RECEPTION_MODULE_SITE	MASS	MarioJose	2023-10-11 02:39:48 PDT(-0700)
65266ccfd2e4250042305615	PCB_RECEPTION_MODULE_SITE	MASS	ClaudiaGemme	2023-10-11 02:37:19 PDT(-0700)
650c35294203f000423efcc1	PCB_RECEPTION_MODULE_SITE	VISUAL_INSPECTION	FuatUstuner	2023-09-21 05:20:57 PDT(-0700)
650b258780b6fa0042d5d944	QA_PRE_THERMAL_CYCLE	LAYER_THICKNESS	FuatUstuner	2023-09-20 10:01:59 PDT(-0700)	Selected
650b254e80b6fa0042d5d563	PCB_QC	HV_LV_TEST	FuatUstuner	2023-09-20 10:01:02 PDT(-0700)	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
PCB_CUTTING	Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
COMPLETE
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ2110264 Quad-PCB/Outer Pre-prod./EPEC-100um ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Cold

No tests are allocated for this stage.

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Not signed-off

No tests are allocated for this stage.

Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

Stage: Wire Bonding (MODULE/WIREBONDING) Complete

No tests are allocated for this stage.

Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

Results Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Stage: PCB ready for module (PCB_READY_FOR_MODULE) Complete

No tests are allocated for this stage.

Stage: Test failed, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

Results Stage: QC (PCB_QC) Complete

Results Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Complete

Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Not signed-off

No tests are allocated for this stage.

Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Not signed-off

No tests are allocated for this stage.

Results Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Complete

Results Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Complete

Results Stage: Cutting (PCB_CUTTING) Complete

Results Stage: Population (PCB_POPULATION) Complete

Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

Results Stage: Reception (PCB_RECEPTION) Complete

Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

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20UPGPQ2110264
Quad-PCB/Outer Pre-prod./EPEC-100um

ITkPD Component Page Jump to ITkPD component page