Top Page > Component List > 20UPGPQ2110291 > QC Result / PCB_RECEPTION_MODULE_SITE / VISUAL_INSPECTION

20UPGPQ2110291
Quad-PCB/Outer Pre-prod./EPEC-100um
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGPQ2110291
Production DB Component ID 02975f3c034f045dc60da4ad18db1320
LocalDB Component ID 645a2875fde33a00427d7bd2
Component Type module_pcb
Super-Component 20UPGM22110291 
Sub-Components No match.
Flags

Properties

Item Data Type Value
PCB Manufacturer string EPEC
PCB design version codeTable 1
PCB vendor technology codeTable 1
SMD population vendor string None

Comments


Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2024-04-02 02:58:41 PDT(-0700)
component ObjectId 645a2875fde33a00427d7bd2
Stage PCB_RECEPTION_MODULE_SITE
Test Type VISUAL_INSPECTION
Institute ObjectId
User Name GiacintoPiacquadio
ObjectId of this record 652936a5d2e42500423a0ce5
ObjectId of RAW record None

Results

Key Data
ANALYSIS_VERSION mqat vNone
INSTRUMENT None
OPERATOR Lando von Etzel
COMPONENT_MISALIGNMENT_GRADE 1
DATA_CONNECTOR_ASSEMBLY_GRADE 1
HV_LV_CONNECTOR_ASSEMBLY_GRADE 1
OBSERVATION Some contaminations
OVERALL_GRADE 2
PARTICULATE_CONTAMINATION_GRADE 2
SCRATCHES_GRADE 1
SHORTS_OR_CLOSE_PROXIMITY_GRADE 1
SOLDERMASK_IRREGULARITIES_GRADE 2
SOLDER_SPILLS_GRADE 1
WATERMARKS_GRADE 1
WIREBOND_PADS_CONTAMINATION_GRADE 2

ProductionDB Record

id652936a5d2e42500423a0ce5
stateready
stateTs2023-10-13T12:23:01.411Z
stateUserIdentity2865-6305-1
date2023-10-13T12:22:00.000Z
testType
id5f644fba928ccc000ad1215f
codeVISUAL_INSPECTION
nameVisual Inspection
stateactive
institution
id5cafa142bc16510009bd660b
codeMPP
nameMax Planck Institute for Physics
user
id649a89f4fe92c20042f7c2dc
userIdentity2865-6305-1
firstNameGiacinto
middleName
lastNamePiacquadio
runNumber0
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis versionstringsingleFalseNoneNoneNone
INSTRUMENTInstrumentstringsingleFalseNoneNoneNone
OPERATOROperatorstringsingleFalseLando von EtzelNoneNone
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
COMPONENT_MISALIGNMENT_GRADEComponent misalignment (scale 1-3)integersingleNoneFalse1None
DATA_CONNECTOR_ASSEMBLY_GRADEData connector assembly issue (scale 1-3)integersingleNoneFalse1None
HV_LV_CONNECTOR_ASSEMBLY_GRADEHV LV connector assembly issue (scale 1-3)integersingleNoneFalse1None
OBSERVATIONObservationstringsingleNoneFalseSome contaminationsNone
OVERALL_GRADEOverall grade (scale 1-3)integersingleNoneFalse2None
PARTICULATE_CONTAMINATION_GRADEParticulate contamination on the PCB including pick-up points (scale 1-3)integersingleNoneFalse2None
SCRATCHES_GRADEScratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)integersingleNoneFalse1None
SHORTS_OR_CLOSE_PROXIMITY_GRADEShorts/close proximity of components due to misalignment (scale 1-3)integersingleNoneFalse1None
SOLDERMASK_IRREGULARITIES_GRADESoldermask irregularity/cracks grade (scale 1-3)integersingleNoneFalse2None
SOLDER_SPILLS_GRADESolder spills as part of assembly process on wirebonding pads (scale 1-3)integersingleNoneFalse1None
WATERMARKS_GRADEWatermarks on the PCB (scale 1-3)integersingleNoneFalse1None
WIREBOND_PADS_CONTAMINATION_GRADEWirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)integersingleNoneFalse2None
cts2023-10-13T12:23:01.411Z
sys
cts2023-10-13T12:23:01.411Z
mts2024-04-02T09:58:41.797Z
rev2
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypeurlurlCernboxfilenameuser
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id64d629ee130e6600422b0eba
userIdentity7544-6134-1
firstNameShudhashil
middleName
lastName
1f39a9d05951cb13c1574f0240bf23632024-04-02T09:58:41.797Z20UPGPQ2110291 back20UPGPQ2110291 backNoneeoshttps://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/1/f/3/1f39a9d05951cb13c1574f0240bf2363?authz=zteos64:MDAwMDAyOWF4nO2QvU7DMBSFlUpl6IQ6drpCCIFEEtv5czyxUomFiinK4NROiEpjK3El1AfoAo_AwACMdEGwsMDAI3TiOZgJFQMDEzN3OLr6dO7V0ek9dnpWvfnw_Pa0MeiWZqLFVmeudy3iuVI1Ljdn_FvHsq6KWs20KJuJK6SxW7urayVskbnYzV1vuM0pDUnEuR3F48zGWOZ2TLhvcz_LEY7iQJD4-NVKjlQFI6mBeIAp8ykjFAgifgqzUjDs45DiZB0nheKLeChK5joFUwpZGVYrZRyCaIgRI36ADhLG8nZYgB2MQyemDkYpVHwq2foNiIpBG9awSZ0FwLVmcKoaw34_FGrKy4r9IIVUDAXYg2Ym2q0P7-HHTra3tC6ul4v-6CY8P7nrO5fD2_1ucBg796vBf7V_qxZeFlerzifUkst-https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/1/f/3/1f39a9d05951cb13c1574f0240bf23631f39a9d05951cb13c1574f0240bf2363
id64d629ee130e6600422b0eba
userIdentity7544-6134-1
firstNameShudhashil
middleName
lastName
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
645a2875fde33a00427d7bd202975f3c034f045dc60da4ad18db1320ready2023-05-09T11:03:17.733Z2355-570-1FalseFalseNoneNoneFalseNoneNone20UPGPQ2110291None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueEPEC
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valuePrototype
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueEPEC (100 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
codePCB_RECEPTION_MODULE_SITE
namePCB Reception at module site
order11
initialFalse
finalFalse
codeEDI
nameUniversity of Edinburgh

Current Stage: Initial Cold

No tests are allocated for this stage.

Past QC Stages and Results

  Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Complete

No tests are allocated for this stage.

  Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

  Stage: Wire Bonding (MODULE/WIREBONDING) Complete

No tests are allocated for this stage.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

  Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Test Local Result ProdDB Record
Mass
(MASS)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology
(METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: PCB ready for module (PCB_READY_FOR_MODULE) Complete

No tests are allocated for this stage.

  Stage: Test failed, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: QC (PCB_QC) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
LV and HV Test
(HV_LV_TEST)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Complete

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Layer thickness measurement
(LAYER_THICKNESS)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Cutting (PCB_CUTTING) Complete

Test Local Result ProdDB Record
Quick Tab Cutting Inspection
(QUICK_TAB_CUTTING_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Population (PCB_POPULATION) Complete

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

  Stage: Reception (PCB_RECEPTION) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Image capture test
(IMAGE_CAPTURE_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Layer thickness measurement
(LAYER_THICKNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
652936a5d2e42500423a0ce5 PCB_RECEPTION_MODULE_SITE VISUAL_INSPECTION GiacintoPiacquadio 2024-04-02 02:58:41 PDT(-0700) Selected
652994f17450a20042fb371c PCB_RECEPTION_MODULE_SITE MASS GiacintoPiacquadio 2023-10-13 12:05:21 PDT(-0700) Selected
65291cf19bbafa0042323661 PCB_RECEPTION_MODULE_SITE METROLOGY GiacintoPiacquadio 2023-10-13 03:33:21 PDT(-0700) Selected
650b258580b6fa0042d5d922 QA_PRE_THERMAL_CYCLE LAYER_THICKNESS FuatUstuner 2023-09-20 10:01:57 PDT(-0700) Selected
650b254c80b6fa0042d5d51c PCB_QC HV_LV_TEST FuatUstuner 2023-09-20 10:01:00 PDT(-0700) Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
PCB_CUTTING
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
COMPLETE
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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