20UPGPQ2110265

MODULE/INITIAL_COLD

Component Information

Serial Number 20UPGPQ2110265
ProdDB ID  a4f4db…8e4db8
LocalDB ID 645a2875012cc800429a22f9
Component Type MODULE_PCB
Parents 20UPGM22110265  20UPGM22110265 
Children No match.
Flags

 Properties

Item Value
PCB Manufacturer EPEC
PCB design version readonly 1
PCB vendor technology readonly 1
SMD population vendor None

 Comments


Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date a year ago
component ObjectId 645a2875012cc800429a22f9
Stage PCB_RECEPTION_MODULE_SITE
Test Type VISUAL_INSPECTION
Institute ObjectId
User Name MarioJose
ObjectId of this record 662641f55e538000343f39c8
ObjectId of RAW record None
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat vNone
INSTRUMENT None
OPERATOR None
WIREBOND_PADS_CONTAMINATION_GRADE N/A
PARTICULATE_CONTAMINATION_GRADE N/A
WATERMARKS_GRADE N/A
SCRATCHES_GRADE N/A
TRACES_GRADE N/A
SOLDERMASK_IRREGULARITIES_GRADE N/A
HV_LV_CONNECTOR_ASSEMBLY_GRADE N/A
DATA_CONNECTOR_ASSEMBLY_GRADE N/A
SOLDER_SPILLS_GRADE N/A
COMPONENT_MISALIGNMENT_GRADE N/A
SHORTS_OR_CLOSE_PROXIMITY_GRADE N/A
OPENS_TOMBSTONING_GRADE N/A
OVERALL_GRADE 1
OBSERVATION N/A

ProductionDB Record

id662641f55e538000343f39c8
stateready
stateTs2024-04-22T10:54:45.993Z
stateUserIdentity6200-2650-1
date2023-09-22T10:54:00.000Z
testType
id5f644fba928ccc000ad1215f
codeVISUAL_INSPECTION
nameVisual Inspection
stateactive
institution
id5d41d52cf6e07b000a559ada
codeINFN_GENOA
nameINFN Genoa
user
id64526724012cc8004282cb9e
userIdentity6200-2650-1
firstNameMario
middleName
lastNameJose
runNumber1
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis versionstringsingleFalseNoneNoneNone
INSTRUMENTInstrumentstringsingleFalseNoneNoneNone
OPERATOROperatorstringsingleFalseNoneNoneNone
results
  • codeWIREBOND_PADS_CONTAMINATION_GRADE
    nameWirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)
    order1
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codePARTICULATE_CONTAMINATION_GRADE
    nameParticulate contamination on the PCB including pick-up points (scale 1-3)
    order2
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeWATERMARKS_GRADE
    nameWatermarks on the PCB (scale 1-3)
    order3
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeSCRATCHES_GRADE
    nameScratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)
    order4
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeTRACES_GRADE
    nameIssues seen on traces like spurious copper, spur, mousebit, pin hole, short, breakout etc. that reduce/cut the copper traces width (grade 1-3)
    order5
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    valueNone
    associateChildNone
  • codeSOLDERMASK_IRREGULARITIES_GRADE
    nameSoldermask irregularity/cracks grade (scale 1-3)
    order6
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeHV_LV_CONNECTOR_ASSEMBLY_GRADE
    nameHV LV connector assembly issue (scale 1-3)
    order7
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeDATA_CONNECTOR_ASSEMBLY_GRADE
    nameData connector assembly issue (scale 1-3)
    order8
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeSOLDER_SPILLS_GRADE
    nameSolder spills as part of assembly process on wirebonding pads (scale 1-3)
    order9
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeCOMPONENT_MISALIGNMENT_GRADE
    nameComponent misalignment (scale 1-3)
    order10
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeSHORTS_OR_CLOSE_PROXIMITY_GRADE
    nameShorts/close proximity of components due to misalignment (scale 1-3)
    order11
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeOPENS_TOMBSTONING_GRADE
    nameOpens or tombstoning, where one end of the component lifts from a pad of the PCB during the soldering process, (scale 1-3)
    order12
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    valueNone
    associateChildNone
  • codeOVERALL_GRADE
    nameOverall grade (scale 1-3)
    order13
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeOBSERVATION
    nameObservation
    order14
    dataTypestring
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
cts2024-04-22T10:54:45.993Z
sys
cts2024-04-22T10:54:45.993Z
mts2024-04-22T12:19:52.169Z
rev1
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypeurlfilenameuser
8d4e09cf7ff70fd8776dbdf4124b43c62024-04-22T12:19:52.169Za testRun image attachmentfrom webApp 2024-04-22T12:19ZNoneeoshttps://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/8/d/4/8d4e09cf7ff70fd8776dbdf4124b43c6?authz=zteos64:MDAwMDAyOWV4nO1Qr0_DQBhNFzYxRZBTFzKB6Y_v-mPtp1CIEQwC01R0vetoxnqX69XMIiDBkCAwBI3AkRAcBkeCIxj-AOwUAQxlQSBQaMyXl5f33vfyujetrqGWD86frjq9dqEnkq22ZnLNoK7NRWWnei_9vhlX5ViJWrKimtiMa7OR21IJZrKRHdrM9oZ9lrGAA81Mmue5CcBzM6RZYKbeKHdgEPmMRtt3RryhCjKsS0KBUAd9Hz23AdRLSF0wBA-CEOJFnYSMvxjXGcQzmRBdMF5qVEJoC7yB64QBghN54XqM2PzM0QcLILCi0AInIWU65bgIIqxE0tTVOFEjn6RSItkVlcbfjUxM06LEH8yYC3R8cElVswatkP5p-93YX1L38-vHy50TeXSRHb5tzfVxsNl66Jy99v7H_eu45OPl-db4BO-g0S8%3d8d4e09cf7ff70fd8776dbdf4124b43c6
id64526724012cc8004282cb9e
userIdentity6200-2650-1
firstNameMario
middleName
lastNameJose
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierancestorMapprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
645a2875012cc800429a22f9a4f4db6b3b99473398cf23fafd8e4db8ready2023-05-09T11:03:17.954Z2355-570-1FalseFalseNoneNoneFalseNoneNone20UPGPQ2110265None
parent
component
id6584597c13093c0042d7e356
code6b689640f585a0e53dcef73bf0e52ca0
stateready
stateTs2023-12-21T15:27:56.046Z
stateUserIdentity7608-2618-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM22110265
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/INITIAL_WARM
nameInitial Warm
highestLevelParent
component
id6584597c13093c0042d7e356
code6b689640f585a0e53dcef73bf0e52ca0
stateready
stateTs2023-12-21T15:27:56.046Z
stateUserIdentity7608-2618-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM22110265
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/INITIAL_WARM
nameInitial Warm
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueEPEC
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valuePrototype
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueEPEC (100 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
codePCB_RECEPTION_MODULE_SITE
namePCB Reception at module site
order9
initialFalse
finalFalse
codeEDI
nameUniversity of Edinburgh

 Current Stage: Initial Cold

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test Local Result ProdDB Record
Mass
(MASS)		 Registered Registered
Metrology
(METROLOGY)		 Registered Registered
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 No result N/A
LV and HV Test
(HV_LV_TEST)		 Registered Registered

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test Local Result ProdDB Record
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
Layer thickness measurement
(LAYER_THICKNESS)		 Registered Registered
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

Population (PCB_POPULATION)

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 No result N/A
Image capture test
(IMAGE_CAPTURE_TEST)		 No result N/A
Layer thickness measurement
(LAYER_THICKNESS)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
662641…3f39c8 PCB_RECEPTION_MODULE_SITE VISUAL_INSPECTION MarioJose N/A a year ago No tags Selected
64d0b1…6ef0ab PCB_QC HV_LV_TEST FuatUstuner N/A a year ago No tags Selected
65e1a4…40a95f PCB_RECEPTION_MODULE_SITE METROLOGY MarioJose N/A a year ago No tags Selected
6537a9…e08c3d PCB_RECEPTION_MODULE_SITE MASS MarioJose N/A 2 years ago No tags Selected
65367b…cd0a51 PCB_RECEPTION_MODULE_SITE METROLOGY MarioJose N/A 2 years ago No tags
65266d…4588ee PCB_RECEPTION_MODULE_SITE MASS MarioJose N/A 2 years ago No tags
65266c…30561a PCB_RECEPTION_MODULE_SITE MASS ClaudiaGemme N/A 2 years ago No tags
64d0b1…6ef26f QA_PRE_THERMAL_CYCLE LAYER_THICKNESS FuatUstuner N/A 2 years ago No tags Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Tab cutting and gross defect inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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