20UPGPQ2110275

MODULE/COMPLETE

Component Information

Serial Number	20UPGPQ2110275
ProdDB ID	a8d35f…2ff592
LocalDB ID	645a2873fde33a00427d7b97
Component Type	MODULE_PCB
Parents	20UPGM22110275
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	EPEC
PCB design version readonly	1
PCB vendor technology readonly	1
SMD population vendor	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	645a2873fde33a00427d7b97
Stage	PCB_RECEPTION_MODULE_SITE
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	GiacintoPiacquadio
ObjectId of this record	6529370fd2e42500423a10a5
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
INSTRUMENT	None
OPERATOR	Lando von Etzel
COMPONENT_MISALIGNMENT_GRADE	2
DATA_CONNECTOR_ASSEMBLY_GRADE	1
HV_LV_CONNECTOR_ASSEMBLY_GRADE	1
OBSERVATION	Contaminations and solder drops next to components
OVERALL_GRADE	3
PARTICULATE_CONTAMINATION_GRADE	3
SCRATCHES_GRADE	2
SHORTS_OR_CLOSE_PROXIMITY_GRADE	1
SOLDERMASK_IRREGULARITIES_GRADE	2
SOLDER_SPILLS_GRADE	3
WATERMARKS_GRADE	2
WIREBOND_PADS_CONTAMINATION_GRADE	2

ProductionDB Record

Expand ProductionDB Record

6529370fd2e42500423a10a5

state

ready

stateTs

2023-10-13T12:24:47.441Z

stateUserIdentity

2865-6305-1

date

2023-10-13T12:23:00.000Z

testType

id	5f644fba928ccc000ad1215f
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5cafa142bc16510009bd660b
code	MPP
name	Max Planck Institute for Physics

user

id	649a89f4fe92c20042f7c2dc
userIdentity	2865-6305-1
firstName	Giacinto
middleName
lastName	Piacquadio

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis version	string	single	False	None	None	None
INSTRUMENT	Instrument	string	single	False	None	None	None
OPERATOR	Operator	string	single	False	Lando von Etzel	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
COMPONENT_MISALIGNMENT_GRADE	Component misalignment (scale 1-3)	integer	single	None	False	2	None
DATA_CONNECTOR_ASSEMBLY_GRADE	Data connector assembly issue (scale 1-3)	integer	single	None	False	1	None
HV_LV_CONNECTOR_ASSEMBLY_GRADE	HV LV connector assembly issue (scale 1-3)	integer	single	None	False	1	None
OBSERVATION	Observation	string	single	None	False	Contaminations and solder drops next to components	None
OVERALL_GRADE	Overall grade (scale 1-3)	integer	single	None	False	3	None
PARTICULATE_CONTAMINATION_GRADE	Particulate contamination on the PCB including pick-up points (scale 1-3)	integer	single	None	False	3	None
SCRATCHES_GRADE	Scratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)	integer	single	None	False	2	None
SHORTS_OR_CLOSE_PROXIMITY_GRADE	Shorts/close proximity of components due to misalignment (scale 1-3)	integer	single	None	False	1	None
SOLDERMASK_IRREGULARITIES_GRADE	Soldermask irregularity/cracks grade (scale 1-3)	integer	single	None	False	2	None
SOLDER_SPILLS_GRADE	Solder spills as part of assembly process on wirebonding pads (scale 1-3)	integer	single	None	False	3	None
WATERMARKS_GRADE	Watermarks on the PCB (scale 1-3)	integer	single	None	False	2	None
WIREBOND_PADS_CONTAMINATION_GRADE	Wirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)	integer	single	None	False	2	None

cts

2023-10-13T12:24:47.441Z

sys

cts	2023-10-13T12:24:47.441Z
mts	2024-04-02T10:01:08.306Z
rev	2

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

url

urlCernbox

filename

user

187c3761d1ad50ee241366735b372699

2024-04-02T10:01:01.104Z

20UPGPQ2110275 front

None

eos

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/1/8/7/187c3761d1ad50ee241366735b372699?authz=zteos64:MDAwMDAyOWN4nO2QP0vDUBTFaUGFLoqLUJeLOAiaP_clr0leETqIg6CDjiFD0vfShtq8R_JapF9EJ3cF5yJuKh38FCIuLoLfwFgcHJycvcPh8uPcy-E0pvVGrVi5vJtNF5sLmR4ovlGfqK0acSwhSyvWp_G3dkWR9wo5UjwrBxYX2qjsliokN3hioeVb3sGmm2Lq-OgaXtBNDESRGnELqRG7SWqjF1BOguOHWngoczgRCogD6DOXMuoDsYkbwSjjDF1s-RjO40TQ-yKO7YUTFYHOuMg1K6TUJrEdnzgMkXi0EzKWVsMomogtM_BNtCPI46Fg8z_AcwZVWs0GRUIhVopBX5aa_X7I5TDOcvaD9IRkNkUHyhGvtlU42x0HR-216f7V8Ak-Ojez--W3ve31i-vnfr_9uvPY_O_2j93C7fvL-dInX_bNig%3d%3d

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/1/8/7/187c3761d1ad50ee241366735b372699

187c3761d1ad50ee241366735b372699

id	64d629ee130e6600422b0eba
userIdentity	7544-6134-1
firstName	Shudhashil
middleName
lastName

ae1e4390c7957deb9c7633dd6afc9871

2024-04-02T10:01:08.306Z

20UPGPQ2110275 back

None

eos

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/a/e/1/ae1e4390c7957deb9c7633dd6afc9871?authz=zteos64:MDAwMDAyOTl4nO1QMUvDQBilhTp0Eift9CEOdUjuLrlrkgPBWXDRzZDh0ru0oTZ3JFeQgrPuzjq7utjBrYg_wFn0BzgKSjdjcXBwcvYbHh-P9x6P175tthvl6tXdw2yl08rtyMjN5tR0G56PlK6QsMfiG_uqLAalnhiZVyMklXVqOTKllo5MkUAKkb0tmtHAkwF1gqifOoSozEmpwo6gaYZJEDHpRQfzRryvCzhUBjwfSMgp4ywED3s0gUkuOaGkF5J4WSeBwRfj4yCemgRsLlVheam1dT3sh4zV7ojtxpxn9XFGXEJ6bhS6BCdQiLHiyxiQBYe6rOWjMmUgjOEw1JXlvxulHou84D-YgdIcM-JDNZH1twZPLjm6eL8_bz2_ZmeX149v0Ynb3VkMP7ZP52Jjsd75n_Zv08LNy0x_Aohqz7U%3d

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/a/e/1/ae1e4390c7957deb9c7633dd6afc9871

ae1e4390c7957deb9c7633dd6afc9871

id	64d629ee130e6600422b0eba
userIdentity	7544-6134-1
firstName	Shudhashil
middleName
lastName

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

645a2873fde33a00427d7b97

a8d35fec6b97854440891af7ef2ff592

ready

2023-05-09T11:03:15.351Z

2355-570-1

False

None

False

None

20UPGPQ2110275

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value EPEC

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Prototype

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

EPEC (100 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code	PCB_RECEPTION_MODULE_SITE
name	PCB Reception at module site
order	11
initial	False
final	False

code	EDI
name	University of Edinburgh

Current Stage: Module Complete

No tests are allocated for this stage.

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	Registered	Registered

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	No result	N/A
Metrology (METROLOGY)	No result	N/A
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
652937…3a10a5	PCB_RECEPTION_MODULE_SITE	VISUAL_INSPECTION	GiacintoPiacquadio	N/A	a year ago	No tags	Selected
652994…fb3690	PCB_RECEPTION_MODULE_SITE	MASS	GiacintoPiacquadio	N/A	2 years ago	No tags	Selected
65291d…323716	PCB_RECEPTION_MODULE_SITE	METROLOGY	GiacintoPiacquadio	N/A	2 years ago	No tags	Selected
650b25…d5d7cc	QA_PRE_THERMAL_CYCLE	LAYER_THICKNESS	FuatUstuner	N/A	2 years ago	No tags	Selected
650b25…37deb2	PCB_QC	HV_LV_TEST	FuatUstuner	N/A	2 years ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ2110275

MODULE/COMPLETE

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Module Complete

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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