Database for ITk Pixel Module

Serial Number	20UPIS07100042
ProdDB ID	44f1df…67219b
LocalDB ID	64411aedd88aa000380b1c33
Component Type	SENSOR_TILE
Parents	20UPGB12100050
Children	No match.
Flags

Item	Value
Main Vendor readonly	7
Sensor Type or Test Structure readonly	1
Version of component	pre-production
Scratch id (to be used if not the same as agreed manufacturer ID)	2010-11335
Alternative Identifier	V8-1-022108-1-024
Original Manufacturer ID	X
Breakdown Voltage (-999 if no breakdown occurred)	None
Depletion Voltage (V)	None

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	64411aedd88aa000380b1c33
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	MarioJose
ObjectId of this record	65786b1b822c6e00426a3d12
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vwebApp
HUM	50
TEMP	22.800000000000015
BREAKDOWN_VOLTAGE	-999
IV_ARRAY	{'voltage': [0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100], 'current': [2.639892e-05, 0.6369306, 0.7464626, 0.8567288, 0.9552934, 1.034068, 1.11011, 1.17997, 1.247614, 1.310967, 1.37406, 1.434727, 1.489407, 1.543888, 1.597116, 1.647726, 1.696149, 1.74139, 1.787388, 1.831823, 1.877204, 1.923677, 1.969284, 2.019108, 2.065947, 2.111089, 2.164857, 2.217775, 2.272146, 2.327614, 2.39649, 2.45544, 2.51646, 2.566377, 2.622955, 2.668381, 2.718264, 2.76401, 2.809126, 2.849298, 2.894471, 2.93714, 2.971701, 3.012212, 3.046258, 3.085178, 3.119484, 3.160696, 3.195062, 3.235154, 3.268583, 3.314534, 3.349238, 3.388825, 3.426199, 3.460545, 3.498502, 3.53625, 3.57038, 3.610063, 3.647782, 3.682435, 3.724572, 3.756525, 3.798486, 3.842584, 3.882481, 3.929805, 3.969808, 4.018506, 4.061837, 4.106637, 4.146604, 4.197076, 4.248578, 4.297986, 4.345303, 4.400824, 4.443586, 4.493194, 4.544215, 4.596744, 4.642845, 4.705962, 4.75797, 4.819501, 4.881227, 4.953908, 5.023402, 5.113641, 5.200511, 5.321802, 5.457634, 5.602692, 5.755314, 5.912687, 6.070223, 6.241922, 6.394358, 6.566972, 6.735015], 'sigma current': [0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0], 'temperature': [22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8], 'humidity': [50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50, 50]}
LEAK_CURRENT	1.969284
MAXIMUM_VOLTAGE	100
NO_BREAKDOWN_VOLTAGE_OBSERVED	True

ProductionDB Record

Current Stage: Parylene Masking

No tests are allocated for this stage.

Past QC Stages and Results

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
65786b…6a3d12	BAREMODULERECEPTION	IV_MEASURE	MarioJose	N/A	2 years ago	No tags	Selected
644123…0b53eb	sensor_manufacturer	IV_MEASURE	StefanoTerzo	N/A	2 years ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPIS07100042

MODULE/PARYLENE_MASKING

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Parylene Masking

Past QC Stages and Results

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

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