20UPGS33300267

MODULE/FINAL_COLD

Component Information

Serial Number 20UPGS33300267
ProdDB ID  542986…ce9a2c
LocalDB ID 6411c97fd1a0c70038eaee4a
Component Type SENSOR_TILE
Parents 20UPGB42200097
Children No match.
Flags

 Properties

Item Value
Main Vendor readonly 3
Sensor Type or Test Structure readonly 3
Version of component pre-production
Scratch id (to be used if not the same as agreed manufacturer ID) 131
Alternative Identifier V4-1-143835-3-002
Original Manufacturer ID Q2
Depletion Voltage (V) 51.49120604042232
Breakdown Voltage (-999 if no breakdown occurred) None

 Comments


Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2 years ago
component ObjectId 6411c97fd1a0c70038eaee4a
Stage BAREMODULERECEPTION
Test Type IV_MEASURE
Institute ObjectId
User Name DimitrisVarouchas
ObjectId of this record 6530fce334a2850042df4f8d
ObjectId of RAW record None
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat vwebApp
HUM 4.428227000000001
TEMP 20.03
BREAKDOWN_VOLTAGE -999
IV_ARRAY {'voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'current': [0.00132821, 0.348495, 0.388654, 0.409962, 0.423627, 0.433455, 0.441563, 0.44749, 0.452557, 0.456842, 0.459931, 0.463075, 0.466553, 0.469676, 0.472343, 0.475538, 0.477982, 0.480237, 0.483406, 0.485678, 0.487693, 0.490272, 0.492704, 0.494713, 0.496677, 0.499227, 0.501097, 0.503195, 0.505376, 0.507175, 0.509329, 0.512025, 0.513639, 0.516063, 0.51771, 0.519831, 0.522606, 0.525899, 0.52691, 0.529654, 0.531845], 'current_sigma': [0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0, 0], 'temperature': [20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03, 20.03], 'humidity': [4.545232, 4.545232, 4.545232, 4.520092, 4.520092, 4.520092, 4.520092, 4.495063, 4.495063, 4.495063, 4.495063, 4.495063, 4.495063, 4.495063, 4.396061, 4.396061, 4.396061, 4.396061, 4.396061, 4.396061, 4.396061, 4.396061, 4.396061, 4.371586, 4.371586, 4.371586, 4.371586, 4.371586, 4.371586, 4.371586, 4.371586, 4.371586, 4.371586, 4.371586, 4.396061, 4.396061, 4.371586, 4.371586, 4.371586, 4.445341, 4.371586]}
LEAK_CURRENT 0.496677
MAXIMUM_VOLTAGE 200
NO_BREAKDOWN_VOLTAGE_OBSERVED True

ProductionDB Record

{}

 Current Stage: Final Cold

Past QC Stages and Results

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
IV measurement
(IV_MEASURE)
Registered Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

QA at Institutes (QA)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
No result N/A
Inter-pixel capacitance
(INTER-PIXEL_CAPACITANCE)
No result N/A
Inter-pixel resistance
(INTER-PIXEL_RESISTANCE)
No result N/A
IT measurement
(IT_MEASURE)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Sensor Metrology: Sensor bow and thickness
(SENSOR_METROLOGY)
No result N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Sensor Metrology: Sensor bow and thickness
(SENSOR_METROLOGY)
No result N/A
Visual inspection
(VISUAL_INSPECTION)
No result N/A

Sensor Manufacturer (sensor_manufacturer)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
Registered Registered
IV measurement
(IV_MEASURE)
Registered Registered
LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
6530fc…df4f8d BAREMODULERECEPTION IV_MEASURE DimitrisVarouchas N/A 2 years ago No tags Selected
65257e…3de9c4 BAREMODULERECEPTION IV_MEASURE EaswarAnand N/A 2 years ago No tags
6411cc…eafc1e sensor_manufacturer IV_MEASURE HuaYe N/A 2 years ago No tags Selected
6411cb…eaf853 sensor_manufacturer CV_MEASURE HuaYe N/A 2 years ago No tags Selected
Stage Tests
sensor_manufacturer
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
WAFER_PROCESSING
  • Visual inspection  (VISUAL_INSPECTION)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
QA
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
  • IT measurement  (IT_MEASURE)
  • Inter-pixel capacitance  (INTER-PIXEL_CAPACITANCE)
  • Inter-pixel resistance  (INTER-PIXEL_RESISTANCE)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
POST_IRRAD
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION
  • IV measurement  (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
Back to top page of this component