Database for ITk Pixel Module

Serial Number	20UPGS33300241
ProdDB ID	bf56f3…67618e
LocalDB ID	63e264856cd28a0036d77fa9
Component Type	SENSOR_TILE
Parents	20UPGB42000083 20UPGB42000083
Children	No match.
Flags

Item	Value
Main Vendor readonly	3
Sensor Type or Test Structure readonly	3
Version of component	pre-production
Scratch id (to be used if not the same as agreed manufacturer ID)
Alternative Identifier	V4-1-269412-3-006
Original Manufacturer ID	Q6
Depletion Voltage (V)	50.02218077840333
Breakdown Voltage (-999 if no breakdown occurred)	None

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	63e264856cd28a0036d77fa9
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	MarioJose
ObjectId of this record	656f1462675ea300411b8223
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vwebApp
HUM	56
TEMP	23.6
BREAKDOWN_VOLTAGE	140
IV_ARRAY	{'voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'current': [6.7012742e-05, 0.00058281764, 0.0012084623, 0.0018910634, 0.0025203683, 0.0032316695, 0.0036143083, 0.0040473966, 0.0044537159, 0.0048778766, 0.0052939057, 0.0058945332, 0.0065127745, 0.0070214598, 0.0075033172, 0.0081479428, 0.0086368214, 0.0092704008, 0.0099875366, 0.010526671, 0.011194911, 0.012310378, 0.01299407, 0.014161163, 0.014592631, 0.015009822, 0.014864655, 0.015349728, 0.10576528, 0.19092201, 0.18607208, 0.18375368, 0.18364421, 0.18507415, 0.18668957, 0.18916518, 0.19155256, 0.1950815, 0.19789338, 0.20158592, 0.20582754], 'sigma current': [0.000166609642582737, 0.000138397470348596, 7.3910656231764e-05, 7.79125313132618e-05, 9.80524247360053e-05, 0.000198651223170788, 0.000201780684155372, 0.000180126356496877, 0.000235063545952345, 0.000194405283600626, 0.000170468863213814, 0.000160837845924894, 0.000221156842055248, 0.000255801211510345, 0.00026295997108678, 0.000158348039872807, 0.000242399858198061, 0.000267057337614528, 0.000115900014204658, 0.000146132504696936, 0.000169405161282058, 0.000245233302746589, 0.000182943885167009, 0.000165803600205182, 0.000404125747520497, 0.000286476115646663, 0.000263109830726638, 0.000242327002779303, 0.0884087852846863, 0.00544005158862487, 0.0041873306030931, 0.00308720041778955, 0.00249931213754905, 0.00220584668154883, 0.00259520786837972, 0.00154182270238832, 0.00147309428768154, 0.00163453671662646, 0.00190645810328997, 0.00117200121484579, 0.00150933468733744], 'temperature': [23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6], 'humidity': [56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56, 56]}
LEAK_CURRENT	0.011194911
MAXIMUM_VOLTAGE	200
NO_BREAKDOWN_VOLTAGE_OBSERVED	False

ProductionDB Record

Current Stage: Initial Cold

No tests are allocated for this stage.

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
656f14…1b8223	BAREMODULERECEPTION	IV_MEASURE	MarioJose	N/A	2 years ago	No tags	Selected
642a91…708dd5	BAREMODULERECEPTION	IV_MEASURE	GianlucaAlimonti	N/A	2 years ago	No tags
63e378…1f41b5	sensor_manufacturer	IV_MEASURE	HuaYe	N/A	2 years ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGS33300241

MODULE/INITIAL_COLD

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Cold

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

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