Database for ITk Pixel Module

Serial Number	20UPGS33300241
ProdDB ID	bf56f3…67618e
LocalDB ID	63e264856cd28a0036d77fa9
Component Type	SENSOR_TILE
Parents	20UPGB42000083 20UPGB42000083
Children	No match.
Flags

Item	Value
Main Vendor readonly	3
Sensor Type or Test Structure readonly	3
Version of component	pre-production
Scratch id (to be used if not the same as agreed manufacturer ID)
Alternative Identifier	V4-1-269412-3-006
Original Manufacturer ID	Q6
Depletion Voltage (V)	50.02218077840333
Breakdown Voltage (-999 if no breakdown occurred)	None

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	63e264856cd28a0036d77fa9
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	GianlucaAlimonti
ObjectId of this record	642a91131f7d450036708dd5
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
HUM	31.831707317073164
TEMP	24.01097560975609
BREAKDOWN_VOLTAGE	0
IV_ARRAY	{'voltage': [0, -5, -10, -15, -20, -25, -30, -35, -40, -45, -50, -55, -60, -65, -70, -75, -80, -85, -90, -95, -100, -105, -110, -115, -120, -125, -130, -135, -140, -145, -150, -155, -160, -165, -170, -175, -180, -185, -190, -195, -200], 'current': [-2.203147042e-10, -7.867966599999999e-09, -1.37981993e-08, -2.2484972e-08, -2.4216983000000002e-08, -2.5355687e-08, -2.8217922000000003e-08, -2.9713903e-08, -3.1401787e-08, -3.1015853e-08, -3.2297446999999995e-08, -3.3420701e-08, -3.3219687999999996e-08, -3.3751024999999994e-08, -3.509492600000001e-08, -3.5298891e-08, -3.5124372000000003e-08, -3.6719884e-08, -3.7367376e-08, -3.7669618e-08, -3.7229982e-08, -3.878369600000001e-08, -3.8708066e-08, -4.0454359e-08, -4.0227064e-08, -4.0726428e-08, -4.1789398000000006e-08, -4.2267985e-08, -4.3065057000000004e-08, -4.309225699999999e-08, -4.3737168000000004e-08, -4.5644001000000005e-08, -4.5832841e-08, -4.7202249999999995e-08, -4.7616331e-08, -4.785619800000001e-08, -4.935575599999999e-08, -5.0504755000000006e-08, -5.0218921000000006e-08, -5.146488e-08, -5.311847799999999e-08], 'sigma current': [3.68691505167346e-10, 1.3333978449749432e-09, 2.6565406062602065e-09, 1.903351920299204e-09, 1.2026087694863839e-09, 3.046261893625613e-10, 5.086399886363632e-10, 8.805549786867375e-10, 2.2660288254761695e-10, 5.059336891343684e-10, 7.569498082002832e-10, 6.40881104564472e-10, 4.517808587947624e-10, 3.3428775778594603e-10, 4.966856512971211e-10, 6.344344536050281e-10, 3.086870078178802e-10, 3.377311129746715e-10, 3.6858345640814814e-10, 6.161190664834557e-10, 2.0278595249397517e-10, 7.202681829584183e-10, 3.387885270981486e-10, 4.246605125783813e-10, 4.2644461652130236e-10, 5.531581147435756e-10, 4.722943887214602e-10, 6.107491046293516e-10, 7.300380681405901e-10, 4.15631440636479e-10, 5.055045467605165e-10, 3.397897128274091e-10, 6.690203397082435e-10, 5.270582571426253e-10, 7.556898295589853e-10, 5.999403314737957e-10, 4.989444522678735e-10, 4.117162550497887e-10, 2.2239460906985407e-10, 4.003907883833273e-10, 3.950673826858167e-10]}
LEAK_CURRENT	-0.053118

ProductionDB Record

Current Stage: Initial Cold

No tests are allocated for this stage.

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
656f14…1b8223	BAREMODULERECEPTION	IV_MEASURE	MarioJose	N/A	2 years ago	No tags	Selected
642a91…708dd5	BAREMODULERECEPTION	IV_MEASURE	GianlucaAlimonti	N/A	2 years ago	No tags
63e378…1f41b5	sensor_manufacturer	IV_MEASURE	HuaYe	N/A	2 years ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGS33300241

MODULE/INITIAL_COLD

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Cold

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

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