Database for ITk Pixel Module

Serial Number	20UPGS33300237
ProdDB ID	cdc55c…54d923
LocalDB ID	63e26477b5aac100367b6a79
Component Type	SENSOR_TILE
Parents	20UPGB42000080
Children	No match.
Flags

Item	Value
Main Vendor readonly	3
Sensor Type or Test Structure readonly	3
Version of component	pre-production
Scratch id (to be used if not the same as agreed manufacturer ID)
Alternative Identifier	V4-1-269412-3-002
Original Manufacturer ID	Q2
Depletion Voltage (V)	50.02218077840333
Breakdown Voltage (-999 if no breakdown occurred)	None

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	63e26477b5aac100367b6a79
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	MarioJose
ObjectId of this record	654ceb3d5bcdfc0042810cb2
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vwebApp
HUM	58
TEMP	23.6
BREAKDOWN_VOLTAGE	-999
IV_ARRAY	{'VOLTAGE': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'CURRENT': [0.000161741334, 0.18026012, 0.24921845, 0.31396566, 0.37497339, 0.4243262, 0.45672137, 0.48736418, 0.50989286, 0.52994377, 0.54807699, 0.55207255, 0.56533603, 0.5703887, 0.58419958, 0.59633483, 0.60938725, 0.61329536, 0.62102533, 0.62345303, 0.6196434, 0.62539478, 0.64068633, 0.63868165, 0.64771633, 0.65761578, 0.66587905, 0.67975631, 0.6836298, 0.68236075, 0.68834561, 0.69948077, 0.71481273, 0.72242208, 0.73388071, 0.73726257, 0.75267103, 0.74098073, 0.75007563, 0.74661525, 0.74778516], 'CURRENT_SIGMA': [3.20127585270874e-05, 0.00352398627517192, 0.00835851245285308, 0.00831314819586418, 0.00895059388827915, 0.00737916748475057, 0.00608666892299063, 0.00635085426156196, 0.00306395114393165, 0.00392828215815769, 0.00453534670040781, 0.00724048046862222, 0.0033978666663217, 0.00661308519678975, 0.00489672015328629, 0.00523894548168809, 0.00558277256661061, 0.00422365237944601, 0.0062679126098008, 0.0051512876039006, 0.00809048381556999, 0.00390438972588549, 0.00233048560092097, 0.00629851723650096, 0.00530643362684393, 0.00590595901861839, 0.00454851563441305, 0.00541529587787223, 0.00308669840282462, 0.00734538515004491, 0.00461384245297776, 0.00862283969862017, 0.00274157349675327, 0.0127029966933634, 0.00345358620145784, 0.00638567180804807, 0.0036263429140251, 0.00636223930390078, 0.00683715998160785, 0.0067410287881376, 0.00323606801418017], 'TEMPERATURE': [23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6, 23.6], 'HUMIDITY': [58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58, 58]}
LEAK_CURRENT	0.6196434
MAXIMUM_VOLTAGE	200
NO_BREAKDOWN_VOLTAGE_OBSERVED	True

ProductionDB Record

Current Stage: Initial Cold

No tests are allocated for this stage.

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
654ceb…810cb2	BAREMODULERECEPTION	IV_MEASURE	MarioJose	N/A	2 years ago	No tags	Selected
642a8a…706c94	BAREMODULERECEPTION	IV_MEASURE	GianlucaAlimonti	N/A	2 years ago	No tags
63e378…b694ee	sensor_manufacturer	IV_MEASURE	HuaYe	N/A	2 years ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGS33300237

MODULE/INITIAL_COLD

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Cold

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

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