Top Page > Component List > 20UPGR92101194 > QC Result > Scan Result / MODULE/INITIAL_WARM / std_analogscan / Run 80

20UPGR92101194
Digital-Quad-Module/ITkPix_v1.1
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGR92101194
Production DB Component ID eecee598a321249865e251f0e3f31c04
LocalDB Component ID 63db0dd7afa0e60036b086de
Component Type module
Super-Component No match.
Sub-Components •  20UPGBQ2101194   Bare Module
•  20UPGFC0087130   FE Chip
•  20UPGFC0087146   FE Chip
•  20UPGFC0087162   FE Chip
•  20UPGFC0087178   FE Chip
•  20UPGPQ1101194   PCB
Flags

Result: 80

Properties

Item Data Type Value
PCB-Bare Orientation isNormal boolean True
FE chip version codeTable ITkpix_v1.1
Wirebond protection roof presence boolean False

Comments

Scan Result: std_analogscan / run 80 (Stage: MODULE/INITIAL_WARM)
(ObjectId: 63db0dd7afa0e60036b086de)


Result Plots

EnMask

OccupancyMap

MeanTotMap-0

SigmaTotMap-0

MeanTotDist-0

SigmaTotDist-0

TagDist

MeanTagMap-0


Details

Scan

Key Data
runNumber 80
testType std_analogscan
stage MODULE/INITIAL_WARM
component 20UPGR92101194
20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
startTime 2023-09-29 11:50:42 PDT(-0700)
finishTime 2023-09-29 11:51:06 PDT(-0700)
user chultquist
site beakanimal.dhcp.lbl.gov
targetCharge -1
targetTot -1
ctrlStatus channel_configuration: 16x1
fe_chip_type: RD53A/B
firmware_hash: 0xcd23cbc
firmware_identifier: 0x1030232
firmware_vers:
fmc_card_type: Ohio Card (Display Port)
fpga_card: Trenz TEF1001_R1
lpm_status: 0
rx_speed: 640Mbps
exec -r configs/controller/specCfg-rd53b-4x4.json -c module-qc-database-tools/20UPGR92101194_good/20UPGR92101194_L2_warm.json -s configs/scans/rd53b/std_analogscan.json -W TEST
stopwatch analysis: 668
config: 1484
processing: 6
scan: 7569
yarr_version git_branch: master
git_date: 2023-05-23 17:19:07 +0200
git_hash: 88f8014cf4952e935d89d5b4792fb7af3482e527
git_subject: Merge branch 'devel' into 'master'
git_tag: v1.4.4
QC False
environment False
plots
passed True

Output Data

Data Display Download
Type FE Chip Serial Number
ctrlCfg N/A
dbCfg N/A
siteCfg N/A
userCfg N/A
scanCfg N/A
feCfg.before 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
feCfg.after 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
EnMask 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
OccupancyMap 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
MeanTotMap-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
SigmaTotMap-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
MeanTotDist-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
SigmaTotDist-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
TagDist 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
MeanTagMap-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178

DCS ### NO DCS DATA ###

Current Stage: Initial Warm

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun! TestRun is missing in LocalDB.
IV measurement
(IV_MEASURE)
No TestRun! TestRun is missing in LocalDB.

Candidate TestRuns of this Stage

Past QC Stages and Results

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebonding Information
(WIREBONDING)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Mass Measurement
(MASS_MEASUREMENT)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

Hide failed test results.

Hide archived test results.

Hide test results not in current stage.

Run Number Test Type Stage User Site Date Tags
80 std_analogscan MODULE/INITIAL_WARM chultquist beakanimal.dhcp.lbl.gov 2023-09-29 11:50:42 PDT(-0700) TEST
14570 std_digitalscan MODULE/INITIAL_WARM eathompson beakanimal.dhcp.lbl.gov 2023-08-22 13:32:38 PDT(-0700) MHT
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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