20UPGR92101194

MODULE/INITIAL_WARM

View QC Summary

Component Information

Serial Number 20UPGR92101194
ProdDB ID  eecee5…f31c04
LocalDB ID 63db0dd7afa0e60036b086de
Component Type MODULE
Parents No match.
Children 20UPGBQ2101194 Bare Module 20UPGFC0087130 FE Chip 20UPGFC0087146 FE Chip 20UPGFC0087162 FE Chip 20UPGFC0087178 FE Chip 20UPGPQ1101194 PCB
Flags
Distribution of chips on wafer

 Properties

Item Value
RD53A_PULL-UP_RESISTOR1 deleted None
RD53A_PULL-UP_RESISTOR2 deleted None
RD53A_PULL-UP_RESISTOR3 deleted None
RD53A_PULL-UP_RESISTOR4 deleted None
IREFTRIM_FE1 deleted None
IREFTRIM_FE2 deleted None
IREFTRIM_FE3 deleted None
IREFTRIM_FE4 deleted None
PCB-Bare Orientation isNormal True
FE chip version ITkpix_v1.1
Wirebond protection roof presence False
FETHICKNESS deleted None
THICKNESS deleted 1

 Comments

Scan Result: std_analogscan / run 80 (Stage: MODULE/INITIAL_WARM)
(ObjectId: 63db0dd7afa0e60036b086de)


Result Plots

EnMask

OccupancyMap

MeanTotMap-0

SigmaTotMap-0

MeanTotDist-0

SigmaTotDist-0

TagDist

MeanTagMap-0


Details

Scan

Key Data
runNumber 80
testType std_analogscan
stage MODULE/INITIAL_WARM
component 20UPGR92101194
20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
startTime 2023-09-29 18:50:42
finishTime 2023-09-29 18:51:06
user chultquist
site beakanimal.dhcp.lbl.gov
targetCharge -1
targetTot -1
ctrlStatus channel_configuration: 16x1
fe_chip_type: RD53A/B
firmware_hash: 0xcd23cbc
firmware_identifier: 0x1030232
firmware_vers:
fmc_card_type: Ohio Card (Display Port)
fpga_card: Trenz TEF1001_R1
lpm_status: 0
rx_speed: 640Mbps
exec -r configs/controller/specCfg-rd53b-4x4.json -c module-qc-database-tools/20UPGR92101194_good/20UPGR92101194_L2_warm.json -s configs/scans/rd53b/std_analogscan.json -W TEST
stopwatch analysis: 668
config: 1484
processing: 6
scan: 7569
yarr_version git_branch: master
git_date: 2023-05-23 17:19:07 +0200
git_hash: 88f8014cf4952e935d89d5b4792fb7af3482e527
git_subject: Merge branch 'devel' into 'master'
git_tag: v1.4.4
QC False
environment False
plots
passed True

Output Data

Data Display Download
Type FE Chip Serial Number
ctrlCfg N/A
dbCfg N/A
siteCfg N/A
userCfg N/A
scanCfg N/A
feCfg.before 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
feCfg.after 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
EnMask 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
OccupancyMap 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
MeanTotMap-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
SigmaTotMap-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
MeanTotDist-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
SigmaTotDist-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
TagDist 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178
MeanTagMap-0 20UPGFC0087130
20UPGFC0087146
20UPGFC0087162
20UPGFC0087178

DCS ### NO DCS DATA ###

 Current Stage: Initial Warm

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No TestRun!
IV measurement
(IV_MEASURE)		 No TestRun!

 Candidate TestRuns of this Stage

Past QC Stages and Results

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A
Wirebonding Information
(WIREBONDING)		 No result N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)		 No result N/A
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)		 No result N/A
Mass Measurement
(MASS_MEASUREMENT)		 No result N/A
Quad Module Metrology
(QUAD_MODULE_METROLOGY)		 No result N/A
Triplet Module Metrology
(TRIPLET_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Initial state to associate flex to bare module (MODULE/INIT)

Hide archived test results.

Run Date Test Type Stage User Site Tags Status
80 2 years ago std_analogscan MODULE/INITIAL_WARM chultquist beakanimal.dhcp.lbl.gov No tags Pass
14570 2 years ago std_digitalscan MODULE/INITIAL_WARM eathompson beakanimal.dhcp.lbl.gov MHT Pass
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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