20UPGB42000072

MODULE/LONG_TERM_STABILITY_TEST

Component Information

Serial Number	20UPGB42000072
ProdDB ID	42953f…bd147a
LocalDB ID	63d148b9049913003677803d
Component Type	BARE_MODULE
Parents	No match.
Children	No match.
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	2
Sensor Type	5
Thickness of FE chips (RD53A)	None
Vendor code readonly	0

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	63d148b9049913003677803d
Stage	BAREMODULERECEPTION
Test Type	QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name	TanviWamorkar
ObjectId of this record	649ddd0de3a8190042ed8407
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v1
SENSOR_X	39.551
SENSOR_Y	41.152
FECHIPS_X	42.231
FECHIPS_Y	40.295
FECHIP_THICKNESS	157
FECHIP_THICKNESS_STD_DEVIATION	2
BARE_MODULE_THICKNESS	325
BARE_MODULE_THICKNESS_STD_DEVIATION	2

ProductionDB Record

Expand ProductionDB Record

649ddd0de3a8190042ed8407

state

ready

stateTs

2023-06-29T19:35:41.272Z

stateUserIdentity

5937-5083-1

date

2023-06-29T19:09:36.782Z

testType

id	5f87e63950d75e000a335aac
code	QUAD_BARE_MODULE_METROLOGY
name	Quad Bare Module Metrology
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6202fb94987fb9000ab47762
userIdentity	5937-5083-1
firstName	Tanvi
middleName
lastName	Wamorkar

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1	None	None

results

code SENSOR_X
name Sensor dimension in x [mm]
order 1
dataType float
valueType single
arrayDimensions None
additional False
value 39.551
associateChild None
code SENSOR_Y
name Sensor dimension in y [mm]
order 2
dataType float
valueType single
arrayDimensions None
additional False
value 41.152
associateChild None
code FECHIPS_X
name FE chips x dimension [mm]
order 5
dataType float
valueType single
arrayDimensions 1
additional False
value 42.231
associateChild None
code FECHIPS_Y
name FE chips y dimension [mm]
order 6
dataType float
valueType single
arrayDimensions 1
additional False
value 40.295
associateChild None

code	FECHIP_THICKNESS
name	Average FE chip thickness [µm]
order	7
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	157
dateTime	2023-07-11T14:44:39.265Z
userIdentity	5937-5083-1
associateChild	None

code	FECHIP_THICKNESS_STD_DEVIATION
name	Std deviation of FE chip thickness [µm]
order	8
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	2
dateTime	2023-07-11T14:44:44.244Z
userIdentity	5937-5083-1
associateChild	None

code	BARE_MODULE_THICKNESS
name	Average bare module thickness [µm]
order	9
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	325
dateTime	2023-07-11T14:44:49.709Z
userIdentity	5937-5083-1
associateChild	None

code	BARE_MODULE_THICKNESS_STD_DEVIATION
name	Std deviation of bare module thickness [µm]
order	10
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	2
dateTime	2023-07-11T14:44:53.825Z
userIdentity	5937-5083-1
associateChild	None

cts

2023-06-29T19:35:41.272Z

sys

cts	2023-06-29T19:35:41.272Z
mts	2023-06-29T19:35:41.272Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

63d148b9049913003677803d

42953fbd7457b3b25a9606d8ccbd147a

ready

2023-01-25T15:20:25.525Z

4709-4605-1

False

None

False

None

20UPGB42000072

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v1.1

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

THICKNESS

Thickness of FE chips (RD53A)

codeTable

False

None

code	value
0	Thin
1	Thick

VENDOR

Vendor code

codeTable

True

False

Advacam

code	value
0	Advacam
1	HPK
2	IZM
3	Leonardo
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	ADVACAM
name	Advacam Oy

Current Stage: Long Term Stability Test

No tests are allocated for this stage.

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
65b030…222c7f	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	Daniel	N/A	a year ago	No tags	Selected
64c000…20ec90	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	TanviWamorkar	N/A	2 years ago	No tags	Selected
64a09f…bfce2a	BAREMODULERECEPTION	VISUAL_INSPECTION	TanviWamorkar	N/A	2 years ago	No tags	Selected
649ddd…ed8407	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	TanviWamorkar	N/A	2 years ago	No tags
649dd6…ebca85	BAREMODULERECEPTION	MASS_MEASUREMENT	TanviWamorkar	N/A	2 years ago	No tags	Selected
649ce4…307b06	BAREMODULERECEPTION	MASS_MEASUREMENT	TanviWamorkar	N/A	2 years ago	No tags

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB42000072

MODULE/LONG_TERM_STABILITY_TEST

Component Information

Distribution of chips on wafer

Properties

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Long Term Stability Test

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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