20UPGB42000072

MODULE/LONG_TERM_STABILITY_TEST

Component Information

Serial Number	20UPGB42000072
ProdDB ID	42953f…bd147a
LocalDB ID	63d148b9049913003677803d
Component Type	BARE_MODULE
Parents	No match.
Children	No match.
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	2
Sensor Type	5
Thickness of FE chips (RD53A)	None
Vendor code readonly	0

Comments

Test: MASS_MEASUREMENT QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	63d148b9049913003677803d
Stage	BAREMODULERECEPTION
Test Type	MASS_MEASUREMENT
Institute ObjectId
User Name	TanviWamorkar
ObjectId of this record	649ce469fe92c20042307b06
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
SCALE_ACCURACY	None
MASS	1242.1

ProductionDB Record

Expand ProductionDB Record

649ce469fe92c20042307b06

state

ready

stateTs

2023-06-29T01:54:49.180Z

stateUserIdentity

5937-5083-1

date

2023-06-29T01:51:00.000Z

testType

id	5f87daff50d75e000a335805
code	MASS_MEASUREMENT
name	Mass Measurement
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6202fb94987fb9000ab47762
userIdentity	5937-5083-1
firstName	Tanvi
middleName
lastName	Wamorkar

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None
SCALE_ACCURACY	Scale Accuracy [mg]	float	single	False	None	None	None

results

code	name	order	dataType	valueType	arrayDimensions	additional	value	associateChild
MASS	Mass [mg]	1	float	single	None	False	1242.1	None

cts

2023-06-29T01:54:49.180Z

sys

cts	2023-06-29T01:54:49.180Z
mts	2023-06-29T01:54:49.180Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

63d148b9049913003677803d

42953fbd7457b3b25a9606d8ccbd147a

ready

2023-01-25T15:20:25.525Z

4709-4605-1

False

None

False

None

20UPGB42000072

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v1.1

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

THICKNESS

Thickness of FE chips (RD53A)

codeTable

False

None

code	value
0	Thin
1	Thick

VENDOR

Vendor code

codeTable

True

False

Advacam

code	value
0	Advacam
1	HPK
2	IZM
3	Leonardo
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	ADVACAM
name	Advacam Oy

Current Stage: Long Term Stability Test

No tests are allocated for this stage.

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
65b030…222c7f	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	Daniel	N/A	a year ago	No tags	Selected
64c000…20ec90	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	TanviWamorkar	N/A	2 years ago	No tags	Selected
64a09f…bfce2a	BAREMODULERECEPTION	VISUAL_INSPECTION	TanviWamorkar	N/A	2 years ago	No tags	Selected
649ddd…ed8407	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	TanviWamorkar	N/A	2 years ago	No tags
649dd6…ebca85	BAREMODULERECEPTION	MASS_MEASUREMENT	TanviWamorkar	N/A	2 years ago	No tags	Selected
649ce4…307b06	BAREMODULERECEPTION	MASS_MEASUREMENT	TanviWamorkar	N/A	2 years ago	No tags

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB42000072

MODULE/LONG_TERM_STABILITY_TEST

Component Information

Distribution of chips on wafer

Properties

Comments

Test: MASS_MEASUREMENT QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Long Term Stability Test

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

Back to top page of this component