20UPGB42000070

MODULE/POST_PARYLENE_WARM

Component Information

Serial Number	20UPGB42000070
ProdDB ID	e5f5c7…61e504
LocalDB ID	63d148b90499130036778038
Component Type	BARE_MODULE
Parents	20UPGM22110573
Children	20UPGFC0084915 FE Chip 20UPGFC0084917 FE Chip 20UPGFC0084916 FE Chip 20UPGFC0084939 FE Chip 20UPGS35300179 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	2
Sensor Type	5
Thickness of FE chips (RD53A)	None
Vendor code readonly	0

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	63d148b90499130036778038
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	TanviWamorkar
ObjectId of this record	64b68d2f0ca4ae0042dcbab3
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vv1
DEFECTS	Sensor scratch (random)
SMD_COMPONENTS_PASSED_QC	N/A
SENSOR_CONDITION_PASSED_QC	2
FE_CHIP_CONDITION_PASSED_QC	1
GLUE_DISTRIBUTION_PASSED_QC	N/A
WIREBONDING_PASSED_QC	N/A
PARYLENE_COATING_PASSED_QC	N/A

ProductionDB Record

Expand ProductionDB Record

64b68d2f0ca4ae0042dcbab3

state

ready

stateTs

2023-07-18T13:01:35.817Z

stateUserIdentity

5937-5083-1

date

2023-07-18T13:00:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6202fb94987fb9000ab47762
userIdentity	5937-5083-1
firstName	Tanvi
middleName
lastName	Wamorkar

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	v1	None	None

results

code

DEFECTS

name

Defect source

order

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

value

Sensor scratch (random)

associateChild

None

codeTable

code	value
0	no defect
1	Sensor systematic rough edge or dicing defect
2	Sensor tooling marks
3	Sensor scratch (random)
4	Sensor dot-like contamination
5	Sensor chipped corner
6	FE chip chipped outer corner
7	FE chip bond pad contamination
8	FE chip irregular dicing
9	FE chip scratch on back side
10	FE chip scratch on top side (pad side)
11	FE chip chipped inner corner
12	FE chip excess material (not diced near FE border)
13	Other defect

code	SMD_COMPONENTS_PASSED_QC
name	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)
order	1
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code SENSOR_CONDITION_PASSED_QC
name Sensor condition passed QC (1: good, 2: issues, 3: bad)
order 6
dataType integer
valueType single
arrayDimensions None
additional False
value 2
associateChild None
code FE_CHIP_CONDITION_PASSED_QC
name FE chip condition passed QC (1: good, 2: issues, 3: bad)
order 7
dataType integer
valueType single
arrayDimensions None
additional False
value 1
associateChild None

code	GLUE_DISTRIBUTION_PASSED_QC
name	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
order	8
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	WIREBONDING_PASSED_QC
name	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
order	9
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	PARYLENE_COATING_PASSED_QC
name	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
order	10
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

cts

2023-07-18T13:01:35.817Z

sys

cts	2023-07-18T13:01:35.817Z
mts	2023-07-18T13:01:35.817Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

63d148b90499130036778038

e5f5c733c7671eaebf7cfd5a9b61e504

ready

2023-01-25T15:20:25.233Z

4709-4605-1

False

None

False

None

20UPGB42000070

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v1.1

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

THICKNESS

Thickness of FE chips (RD53A)

codeTable

False

None

code	value
0	Thin
1	Thick

VENDOR

Vendor code

codeTable

True

False

Advacam

code	value
0	Advacam
1	HPK
2	IZM
3	Leonardo
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	ADVACAM
name	Advacam Oy

Current Stage: Post-Parylene Warm

No tests are allocated for this stage.

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
65b02d…ba6ead	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	Daniel	N/A	a year ago	No tags	Selected
64bffe…f5773a	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	TanviWamorkar	N/A	2 years ago	No tags	Selected
64b68d…dcbab3	BAREMODULERECEPTION	VISUAL_INSPECTION	TanviWamorkar	N/A	2 years ago	No tags	Selected
64b5b6…d7a0a7	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	TanviWamorkar	N/A	2 years ago	No tags
64b5b5…d79f6e	BAREMODULERECEPTION	MASS_MEASUREMENT	TanviWamorkar	N/A	2 years ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB42000070

MODULE/POST_PARYLENE_WARM

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Post-Parylene Warm

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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