20UPGB42000017

MODULE/FINAL_METROLOGY

Component Information

Serial Number	20UPGB42000017
ProdDB ID	70d388…cb9968
LocalDB ID	63d148b20499130036777fc9
Component Type	BARE_MODULE
Parents	20UPGM22210120
Children	20UPGFC0086726 FE Chip 20UPGFC0086729 FE Chip 20UPGFC0086727 FE Chip 20UPGFC0086724 FE Chip 20UPGS35300133 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	2
Sensor Type	5
Thickness of FE chips (RD53A)	None
Vendor code readonly	0

Comments

Test: VISUAL_INSPECTION QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	False
Date	a year ago
component ObjectId	63d148b20499130036777fc9
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	RuiruiHan
ObjectId of this record	654cc1cab60c210041de720c
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v1
DEFECTS	['1', '2', '3', '4', '8', '9', '13']
FE_CHIP_CONDITION_PASSED_QC	2
GLUE_DISTRIBUTION_PASSED_QC	N/A
PARYLENE_COATING_PASSED_QC	N/A
SENSOR_CONDITION_PASSED_QC	2
SMD_COMPONENTS_PASSED_QC	N/A
WIREBONDING_PASSED_QC	N/A

ProductionDB Record

Expand ProductionDB Record

654cc1cab60c210041de720c

state

ready

stateTs

2023-11-09T11:26:02.108Z

stateUserIdentity

8075-7151-1

date

2023-11-09T11:25:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	59d60ee4ed67730005160cd9
code	GL
name	Glasgow University

user

id	5fcf9a6067b73a000ab90abe
userIdentity	8075-7151-1
firstName	Ruirui
middleName
lastName	Han

runNumber

passed

False

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1	None	None

results

code

DEFECTS

name

Defect source

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

value

associateChild

None

codeTable

code	value
0	no defect
1	Sensor systematic rough edge or dicing defect
2	Sensor tooling marks
3	Sensor scratch (random)
4	Sensor dot-like contamination
5	Sensor chipped corner
6	FE chip chipped outer corner
7	FE chip bond pad contamination
8	FE chip irregular dicing
9	FE chip scratch on back side
10	FE chip scratch on top side (pad side)
11	FE chip chipped inner corner
12	FE chip excess material (not diced near FE border)
13	Other defect

code FE_CHIP_CONDITION_PASSED_QC
name FE chip condition passed QC (1: good, 2: issues, 3: bad)
dataType integer
valueType single
arrayDimensions None
additional False
value 2
associateChild None

code	GLUE_DISTRIBUTION_PASSED_QC
name	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	PARYLENE_COATING_PASSED_QC
name	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code SENSOR_CONDITION_PASSED_QC
name Sensor condition passed QC (1: good, 2: issues, 3: bad)
dataType integer
valueType single
arrayDimensions None
additional False
value 2
associateChild None

code	SMD_COMPONENTS_PASSED_QC
name	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	WIREBONDING_PASSED_QC
name	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

cts

2023-11-09T11:26:02.108Z

sys

cts	2023-11-09T11:26:02.108Z
mts	2024-05-23T11:41:49.480Z
rev	12

defects

code	name	description	properties
06b3785e1374bc08ce16e6ea	chip side: tooling marks/scratch/ dot and mesh like contamination
2d6a1e4d4e8a56ca71604983	sensor side: tooling marks/scratch/ dot like contamination
2eada8b4d9b19d3a3d51d077	sensor bad edge/dicing
10433d6da827aec76832a795	chip bad edge/dicing

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

63d148b20499130036777fc9

70d38898e2d0bb74b7f86ece54cb9968

ready

2023-01-25T15:20:18.290Z

4709-4605-1

False

None

False

None

20UPGB42000017

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v1.1

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

THICKNESS

Thickness of FE chips (RD53A)

codeTable

False

None

code	value
0	Thin
1	Thick

VENDOR

Vendor code

codeTable

True

False

Advacam

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	ADVACAM
name	Advacam Oy

Current Stage: Final flatness measurement

No tests are allocated for this stage.

Past QC Stages and Results

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
654cc1…de720c	BAREMODULERECEPTION	VISUAL_INSPECTION	RuiruiHan	N/A	a year ago	No tags	Selected
6565f8…eba06a	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	RichardBates	N/A	2 years ago	No tags	Selected
65576a…ff9e11	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	RichardBates	N/A	2 years ago	No tags	Selected
65575e…ff5a9b	BAREMODULERECEPTION	MASS_MEASUREMENT	RichardBates	N/A	2 years ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB42000017

MODULE/FINAL_METROLOGY

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Final flatness measurement

Past QC Stages and Results

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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