Database for ITk Pixel Module

Serial Number	20UPIS18100364
ProdDB ID	cc2de1…9c8177
LocalDB ID	639aee4a006b1b003626cda5
Component Type	SENSOR_TILE
Parents	20UPGB12200128
Children	No match.
Flags

Item	Value
Main Vendor readonly	8
Sensor Type or Test Structure readonly	1
Alternative Identifier	V9-1-000606-1-022
Version of component	pre-production
Scratch id (to be used if not the same as agreed manufacturer ID)	SINTEF-3D-R6-G06
Original Manufacturer ID	None
Breakdown Voltage (-999 if no breakdown occurred)	None
Depletion Voltage (V)	None

Key	Data
QC Passed	True
Date	10 months ago
component ObjectId	639aee4a006b1b003626cda5
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	AlekseiGrigorev
ObjectId of this record	67ac8f36e286112cecef661b
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vwebApp SHA:3a9a1ca
HUM	50.30218186270074
TEMP	20.038695446280546
BREAKDOWN_VOLTAGE	17.5
IV_ARRAY	{'voltage': [0, 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 5.5, 6, 6.5, 7, 7.5, 8, 8.5, 9, 9.5, 10, 10.5, 11, 11.5, 12, 12.5, 13, 13.5, 14, 14.5, 15, 15.5, 16, 16.5, 17, 17.5, 18, 18.5, 19, 19.5, 20, 20.5, 21], 'current': [0.04182163, 2.014269, 3.8828250000000004, 4.9601619999999995, 5.617926000000001, 6.050815, 6.355614, 6.580567, 6.752875, 6.879767, 6.976452, 7.0603750000000005, 7.142132, 7.225404, 7.307412, 7.383562, 7.455915999999999, 7.525479000000001, 7.59191, 7.652388, 7.699794000000001, 7.737177, 7.774528999999999, 7.820937, 7.8780470000000005, 7.937964000000001, 7.999269, 8.060426, 8.120807, 8.179912999999999, 8.234768, 8.278654999999999, 8.313412999999999, 8.350858, 8.395594, 8.450302, 8.511486999999999, 8.574496, 8.637291999999999, 8.726937000000001, 48.07483, 98.62807, 155.6489], 'sigma current': [1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06, 1e-06]}
LEAK_CURRENT	48.07483
MAXIMUM_VOLTAGE	21
NO_BREAKDOWN_VOLTAGE_OBSERVED	False

ProductionDB Record

Expand ProductionDB Record

67ac8f36e286112cecef661b

state

ready

stateTs

2025-02-12T12:08:22.110Z

stateUserIdentity

269-8073-1

date

2025-02-12T12:07:00.000Z

testType

id	5b1a3abf130f5600054a42a8
code	IV_MEASURE
name	IV measurement
state	active

institution

id	5a832050daf1a000052e3e98
code	UIO
name	University of Oslo, Department of Physics

user

id	61ae0eba6d9ad9000a62cfa3
userIdentity	269-8073-1
firstName	Aleksei
middleName
lastName	Grigorev

runNumber

...

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	webApp SHA:3a9a1ca	None	None
HUM	Humidity [%]	float	single	True	50.30218186270074	None	None
TEMP	Temperature [°C]	float	single	True	20.038695446280546	None	None

results

code BREAKDOWN_VOLTAGE
name Breakdown voltage [V] (if no breakdown put -999)
dataType float
valueType single
arrayDimensions None
additional False
value 17.5
associateChild None

code

IV_ARRAY

name

IV data

dataType

object

valueType

single

arrayDimensions

additional

False

value

voltage	0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5 13 13.5 14 14.5 15 15.5 16 16.5 17 17.5 18 18.5 19 19.5 20 20.5 21
current	0.04182163 2.014269 3.8828250000000004 4.9601619999999995 5.617926000000001 6.050815 6.355614 6.580567 6.752875 6.879767 6.976452 7.0603750000000005 7.142132 7.225404 7.307412 7.383562 7.455915999999999 7.525479000000001 7.59191 7.652388 7.699794000000001 7.737177 7.774528999999999 7.820937 7.8780470000000005 7.937964000000001 7.999269 8.060426 8.120807 8.179912999999999 8.234768 8.278654999999999 8.313412999999999 8.350858 8.395594 8.450302 8.511486999999999 8.574496 8.637291999999999 8.726937000000001 48.07483 98.62807 155.6489
sigma current	1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06 1e-06

associateChild

None

code LEAK_CURRENT
name Leakage current at depletion voltage + 20 (50) V for 3D (planar) sensors [μA]
dataType float
valueType single
arrayDimensions None
additional False
value 48.07483
associateChild None
code MAXIMUM_VOLTAGE
name Maximum measured Voltage [V]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 21
associateChild None
code NO_BREAKDOWN_VOLTAGE_OBSERVED
name No breakdown voltage observed
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value False
associateChild None

cts

2025-02-12T12:08:22.110Z

sys

cts	2025-02-12T12:08:22.110Z
mts	2025-02-12T12:08:22.110Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

639aee4a006b1b003626cda5

cc2de1f73b573ee36cdf6830ec9c8177

ready

2022-12-15T09:52:10.206Z

269-8073-1

False

None

False

None

20UPIS18100364

V9-1-000606-1-022

parent

component

669787b99d270d00432842c4

code

01087d6a84b926a2ccb85efc078c7c7b

state

ready

stateTs

2024-07-17T08:58:33.932Z

stateUserIdentity

23-6780-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGB12200128

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	BARE_MODULE
name	Bare Module

type

code	SINGLE_BARE_MODULE
name	Single bare module

testedAtStage

code	BAREMODULEASSEMBLY
name	Bare module assembly

highestLevelParent

component

6788ddac38efa70a43cc9c35

code

4fab977aaa263d37e1df9b6b6c59978b

state

ready

stateTs

2025-01-16T10:21:32.621Z

stateUserIdentity

5307-101-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPIM02202117

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PI
name	Inner pixels

componentType

code	MODULE
name	Module

type

code	TRIPLET_L0_RING0_MODULE
name	Triplet L0 Ring0 module

testedAtStage

code	MODULE/WIREBONDING
name	Wire Bonding

code	P
name	Pixels

code	PI
name	Inner pixels

code	SENSOR_TILE
name	Sensor Tile

code	L0_INNER_PIXEL_3D_SENSOR_TILE_50
name	L0 Inner Pixel 3D Sensor Tile (50x50)

code	name	dataType	required	default	value
MAIN_VENDOR	Main Vendor	integer	True	False	8
SENSOR_TYPE_OR_TEST_STRUCTURE	Sensor Type or Test Structure	integer	True	False	1
MAN_SNO	Alternative Identifier	string	True	True	V9-1-000606-1-022
VERSION	Version of component	string	True	False	pre-production
SENSOR_SCRATCHID	Scratch id (to be used if not the same as agreed manufacturer ID)	string	False	False	SINTEF-3D-R6-G06

code	BAREMODULERECEPTION
name	Bare module reception at ITk institute
order	6
initial	False
final	False

code	SINTEF
name	SINTEF MiNaLab

Current Stage: Final flatness measurement

No tests are allocated for this stage.

Past QC Stages and Results

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
67ac8f…ef661b	BAREMODULERECEPTION	IV_MEASURE	AlekseiGrigorev	N/A	10 months ago	No tags	Selected
639b0b…398757	sensor_manufacturer	IV_MEASURE	AlekseiGrigorev	N/A	3 years ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPIS18100364

MODULE/FINAL_METROLOGY

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Final flatness measurement

Past QC Stages and Results

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

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