Database for ITk Pixel Module

Serial Number	20UPGS35300148
ProdDB ID	e7097c…eb7876
LocalDB ID	62ba0c1fe684f9000ada971c
Component Type	SENSOR_TILE
Parents	20UPGB42000065
Children	No match.
Flags

Item	Value
Alternative Identifier	V6-1-352921-3-005
Main Vendor readonly	5
Sensor Type or Test Structure readonly	3
Version of component	pre-production
Scratch id (to be used if not the same as agreed manufacturer ID)	0009
Original Manufacturer ID	MSLE
Depletion Voltage (V)	51
Breakdown Voltage (-999 if no breakdown occurred)	None

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	62ba0c1fe684f9000ada971c
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	RichardBates
ObjectId of this record	64beac07c8312c0042c53676
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vwebApp
HUM	25.841463414634145
TEMP	22.768292682926827
BREAKDOWN_VOLTAGE	-999
IV_ARRAY	{'voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'current': [0.0189054, 0.127765, 0.163014, 0.179632, 0.18474, 0.187254, 0.188952, 0.191114, 0.193032, 0.195011, 0.196557, 0.198164, 0.199724, 0.20108, 0.202557, 0.203865, 0.205107, 0.206219, 0.207384, 0.208608, 0.209863, 0.211202, 0.212631, 0.213264, 0.214756, 0.216665, 0.218248, 0.219815, 0.221514, 0.223153, 0.224857, 0.226536, 0.228301, 0.229905, 0.231844, 0.233462, 0.235136, 0.23701, 0.238847, 0.240876, 0.242669], 'sigma current': [0.01913978, 8.383184e-05, 0.0001878652, 6.876692e-05, 2.108185e-05, 2.716207e-05, 2.973961e-05, 9.766155e-05, 5.266245e-05, 0.0001690792, 0.0001106596, 3.533962e-05, 8.435375e-05, 3.366502e-05, 7.180993e-05, 0.0001102774, 5.755191e-05, 5.839521e-05, 4.812022e-05, 3.119829e-05, 0.0001015491, 5.711587e-05, 7.030884e-05, 6.239658e-05, 5.719363e-05, 9.834746e-05, 6.579429e-05, 4.600725e-05, 5.985167e-05, 5.657836e-05, 9.888826e-05, 0.0001000222, 0.0001357653, 0.0001762101, 0.0002363707, 0.0001804193, 0.0001977765, 0.0002014944, 0.0001454533, 0.0001605684, 0.0001306777], 'temperature': [22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.7, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.8, 22.9, 22.9, 22.9], 'humidity': [26.5, 26.3, 26, 26.5, 24.4, 26, 26.5, 26.8, 26.7, 24.4, 25.1, 26, 26.5, 24.4, 25.2, 26.6, 25.1, 24.8, 25.7, 27, 24.3, 27, 24.5, 26.7, 26.3, 26.4, 24.6, 24.5, 26.6, 26.4, 25.7, 26.3, 25.3, 24.5, 26.8, 24.3, 26.8, 26.6, 26.6, 26.6, 26.2]}
LEAK_CURRENT	0.214756
MAXIMUM_VOLTAGE	200
NO_BREAKDOWN_VOLTAGE_OBSERVED	True

ProductionDB Record

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
64beac…c53676	BAREMODULERECEPTION	IV_MEASURE	RichardBates	N/A	2 years ago	No tags	Selected
62bc3d…df3f34	sensor_manufacturer	IV_MEASURE	HanadiAli	N/A	3 years ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGS35300148

MODULE/THERMAL_CYCLES

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Thermal Cycles

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

Back to top page of this component