Database for ITk Pixel Module

Serial Number	20UPGS35300111
ProdDB ID	0057d5…42f96d
LocalDB ID	629f7cd48ee6e5000a606842
Component Type	SENSOR_TILE
Parents	20UPGB42000018
Children	No match.
Flags

Item	Value
Alternative Identifier	V6-1-352905-3-001
Main Vendor readonly	5
Sensor Type or Test Structure readonly	3
Version of component	pre-production
Scratch id (to be used if not the same as agreed manufacturer ID)	0010
Original Manufacturer ID	MSLA
Depletion Voltage (V)	49
Breakdown Voltage (-999 if no breakdown occurred)	None

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	629f7cd48ee6e5000a606842
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	JennyLunde
ObjectId of this record	65523c7d1525bb00422e5ae1
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vwebApp
HUM	47.900000000000006
TEMP	21
BREAKDOWN_VOLTAGE	-999
IV_ARRAY	{'voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'current': [0.0005509590000000001, 0.037733752999999995, 0.068311263, 0.096583077, 0.12290241, 0.13973652, 0.16951431, 0.18339003, 0.19077727000000003, 0.19627054, 0.20078431, 0.20330731, 0.2069106, 0.20854877000000002, 0.21214894, 0.21351899000000002, 0.21568943, 0.21720035000000001, 0.21864603999999999, 0.22049528, 0.22333438, 0.22391139000000002, 0.22655707, 0.22728030999999999, 0.22935467, 0.23110994999999998, 0.23202826000000001, 0.23258732, 0.23491937000000002, 0.23638008, 0.23796379, 0.23951629, 0.24261626000000003, 0.24417810999999998, 0.24605068, 0.24680613, 0.29088201, 0.25184614, 0.25494587999999996, 0.23961759000000002, 0.27415264], 'sigma current': [0.00010478452269618194, 9.446740320225669e-05, 7.859693916149454e-05, 0.00010452622574157055, 0.0013496741618710141, 0.0010407611699563375, 0.0009590976203934864, 0.0008201056694109637, 0.0007209666659731542, 0.0006687407489702808, 0.0006270488310774179, 0.0002694434199522325, 0.0006016068335900294, 0.0001813594285757789, 0.00018436191580692435, 0.0007690108805038641, 0.0006954614488077519, 0.00046219695957940514, 0.0001678485243042399, 0.00037803331951914997, 9.48326104248945e-05, 0.0004644418165927776, 0.0002170318668357782, 0.00041646305278299645, 0.0006466522232923122, 0.0001456742274925652, 0.000540722603353858, 4.025247542422251e-05, 0.0004510224755424534, 0.0005604489327514331, 0.0006244956515283226, 0.00011660620766780168, 6.102961394091695e-05, 0.0003219124982903897, 0.0009114968126963295, 0.002413416236628526, 0.1183002692156179, 0.004938122598541093, 0.039866895062104966, 0.030591780731520753, 0.11946520953920899], 'temperature': [21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21, 21], 'humidity': [47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9, 47.9]}
LEAK_CURRENT	0.22049528
MAXIMUM_VOLTAGE	200
NO_BREAKDOWN_VOLTAGE_OBSERVED	True

ProductionDB Record

Current Stage: Long Term Stability Test

No tests are allocated for this stage.

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
65523c…2e5ae1	BAREMODULERECEPTION	IV_MEASURE	JennyLunde	N/A	2 years ago	No tags	Selected
62a20f…e78c10	sensor_manufacturer	IV_MEASURE	HanadiAli	N/A	3 years ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGS35300111

MODULE/LONG_TERM_STABILITY_TEST

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Long Term Stability Test

Past QC Stages and Results

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

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